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参数资料
| 型号： | W3H128M72E-667SBM |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 128M X 72 DDR DRAM, 1.25 ns, PBGA208 |
| 封装： | 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件页数： | 26/32页 |
| 文件大小： | 988K |
| 代理商： | W3H128M72E-667SBM |
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W3H128M72E-XSBX
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History Continued
Rev #
History
Release Date
Status
Rev 5
Changes (Pg. 1)
5.1 Change "This product is under development, is not fully
qualied or characterized and is subject to change without
notice
5.2 Add thinner "NB" version of part is under development.
Only difference between "NB" and "SB" is thickness. "SB"
= 4.65mm (0.283) max and "NB" = 3.97mm (0.156) max; a
difference of .68mm (0.027) max
March 2009
Final
Rev 6
Changes (Pg. 24, 26)
6.1 Change ICC2P to 55mA on all speed grades
6.2 Change ICC6 to 45mA on all speed grades
6.3 Change ICC7 to 1,775mA on "400 and 533" speed grades
and 1,975mA on 667 speed grade
6.4 Change tAC to -100ps min on all speed grades and 1,250ps
max on 667 speed grade, 1,350ps on 400 and 533 speed
grades
6.5 Change tDSA to 400ps on 533 speed grade
6.6 Change tDQSCK to -100ps min on all speed grades and
1,250ps max on 667 speed grade, 1,350ps on 400 and 533
speed grades
September 2009
Final
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