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参数资料
| 型号： | W3H32M72E-667SB2M |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
| 封装： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件页数： | 9/25页 |
| 文件大小： | 1062K |
| 代理商： | W3H32M72E-667SB2M |
W3H32M72E-XSB2X
November 2010 2010 Microsemi Corporation. All rights reserved.
17
Microsemi Corporation (602) 437-1520 www.whiteedc.com
Rev. 3
www.microsemi.com
Microsemi Corporation reserves the right to change products or specications without notice.
DC OPERATING CONDITIONS
All voltages referenced to VSS
Parameter
Symbol
Min
Typical
Max
Unit
Notes
Supply voltage
VCC
1 .7
1 .8
1 .9
V
1
I/O Supply voltage
VCCQ
1 .7
1 .8
1 .9
V
4
I/O Reference voltage
VREF
0.49 x VCCQ
0.50 x VCCQ
0.51 x VCCQ
V2
I/O Termination voltage
VTT
VREF-0.04
VREF
VREF + 0.04
V
3
Notes:
1. VCC VCCQ must track each other. VCCQ must be less than or equal to VCC.
2. VREF is expected to equal VCCQ/2 of the transmitting device and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed ±1 percent of the DC value. Peak-to-peak AC noise
on VREF may not exceed ±2 percent of VREF. This measurement is to be taken at the nearest VREF bypass capacitor.
3. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF and must track variations in the DC level of VREF.
4. VCCQ tracks with VCC track with VCC.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
MIN
MAX
U nit
VCC
Voltage on VCC pin relative to VSS
-1.0
2.3
V
VCCQ
Voltage on VCCQ pin relative to VSS
-0.5
2.3
V
VIN, VOUT
Voltage on any pin relative to VSS
-0.5
2.3
V
TSTG
Storage temperature
-55
125
°C
TCASE
Device operating temperature
-55
125
°C
IL
Input leakage current; Any input 0V<VIN<VCC; VREF input 0V<VIN<0.95V;
Other pins not under test = 0V
Command/Address,
RAS#, CAS#, WE#,
CS#, CKE
-25
25
μA
CK, CK#
-5
5
μA
DM
-5
5
μA
IOZ
Output leakage current;
0V<VOUT<VCCQ; DQs and ODT are disable
DQ, DQS, DQS#
-5
5
μA
IVREF
VREF leakage current; VREF = Valid VREF level
-18
18
μA
INPUT/OUTPUT CAPACITANCE
TA = 25°C, f = 1MHz, VCC = VCCQ = 1.8V
Parameter
Symbol
Max
Unit
Input capacitance (A0 - A12, BA0 - BA1 ,CS#, RAS#,CAS#,WE#, CKE, ODT)
CIN1
22
pF
Input capacitance CK, CK#
CIN2
9pF
Input capacitance DM, DQS, DQS#
CIN3
9pF
Input capacitance DQ0 - 71
COUT
10
pF
相关PDF资料 |
PDF描述 |
|---|---|
| W3H32M72E-667SBC | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
| W3H64M16E-400BC | 64M X 16 DDR DRAM, 0.6 ns, PBGA79 |
| W3H64M64E-400SBC | 64M X 64 DDR DRAM, 0.6 ns, PBGA208 |
| W3H64M72E-400ESI | 64M X 72 DDR DRAM, 0.6 ns, PBGA208 |
| W3H64M72E-400ESI | 64M X 72 DDR DRAM, 0.6 ns, PBGA208 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3H32M72E-667SB2M/T/R | 制造商:Microsemi Corporation 功能描述:PBGA,32M X72,DDR2 SDRAM, 1.8V - Tape and Reel |
| W3H32M72E-667SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
| W3H32M72E-667SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M72E-667SBM | 制造商:PMG/Microsemi 功能描述: |
| W3H32M72E-ES | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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