参数资料
型号: XA3S400A-4FGG400I
厂商: Xilinx Inc
文件页数: 22/57页
文件大小: 0K
描述: IC FPGA SPARTAN-3A 400K 400-FBGA
产品培训模块: Extended Spartan 3A FPGA Family
标准包装: 60
系列: Spartan®-3A XA
LAB/CLB数: 896
逻辑元件/单元数: 8064
RAM 位总计: 368640
输入/输出数: 311
门数: 400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 400-BGA
供应商设备封装: 400-FBGA(21x21)
XA Spartan-3A Automotive FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
29
Timing Measurement Methodology
When measuring timing parameters at the programmable I/Os, different signal standards call for different test conditions.
Table 26 lists the conditions to use for each standard.
The method for measuring Input timing is as follows: A signal that swings between a Low logic level of VL and a High logic
level of VH is applied to the Input under test. Some standards also require the application of a bias voltage to the VREF pins
of a given bank to properly set the input-switching threshold. The measurement point of the Input signal (VM) is commonly
located halfway between VL and VH.
The Output test setup is shown in Figure 9. A termination voltage VT is applied to the termination resistor RT, the other end
of which is connected to the Output. For each standard, RT and VT generally take on the standard values recommended for
minimizing signal reflections. If the standard does not ordinarily use terminations (for example, LVCMOS, LVTTL), then RT
is set to 1 M
to indicate an open connection, and V
T is set to zero. The same measurement point (VM) that was used at the
Input is also used at the Output.
X-Ref Target - Figure 9
Figure 9: Output Test Setup
FPGA Output
VT (VREF)
RT (RREF)
VM (VMEAS)
CL (CREF)
DS681_08_041111
Notes:
1.
The names shown in parentheses are
used in the IBIS file.
相关PDF资料
PDF描述
XC6SLX25T-3CSG324C IC FPGA SPARTAN 6 24K 324CSGBGA
XCV50E-6PQ240C IC FPGA 1.8V C-TEMP 240-PQFP
ABB50DHBS CONN EDGECARD 100PS R/A .050 SLD
XCV50E-6FG256C IC FPGA 1.8V C-TEMP 256-FBGA
XC6SLX25-L1CSG324I IC FPGA SPARTAN 6 24K 324CSGBGA
相关代理商/技术参数
参数描述
XA3S400A-4FGG400Q 功能描述:IC FPGA SPARTAN-3A 400K 400-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S400A-4FTG256I 功能描述:IC FPGA SPARTAN-3A 400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S400A-4FTG256Q 功能描述:IC FPGA SPARTAN-3A 400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S500E 制造商:XILINX 制造商全称:XILINX 功能描述:XA Spartan-3E Automotive FPGA Family Data Sheet
XA3S500E-4CPG132I 功能描述:IC FPGA SPARTAN-3E 500K 132CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)