参数资料
型号: XA3S400A-4FGG400I
厂商: Xilinx Inc
文件页数: 42/57页
文件大小: 0K
描述: IC FPGA SPARTAN-3A 400K 400-FBGA
产品培训模块: Extended Spartan 3A FPGA Family
标准包装: 60
系列: Spartan®-3A XA
LAB/CLB数: 896
逻辑元件/单元数: 8064
RAM 位总计: 368640
输入/输出数: 311
门数: 400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 400-BGA
供应商设备封装: 400-FBGA(21x21)
XA Spartan-3A Automotive FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
47
Configuration and JTAG Timing
General Configuration Power-On/Reconfigure Timing
X-Ref Target - Figure 11
Figure 11: Waveforms for Power-On and the Beginning of Configuration
Table 44: Power-On Timing and the Beginning of Configuration
Symbol
Description
Device
Speed Grade: -4
Units
Min
Max
TPOR(2)
The time from the application of VCCINT, VCCAUX, and VCCO
Bank 2 supply voltage ramps (whichever occurs last) to the
rising transition of the INIT_B pin
All
–18
ms
TPROG
The width of the low-going pulse on the PROG_B pin
All
0.5
–s
TPL(2)
The time from the rising edge of the PROG_B pin to the
rising transition on the INIT_B pin
XA3S200A
–0.5
ms
XA3S400A
–1
ms
XA3S700A
–2
ms
XA3S1400A
–2
ms
TINIT
Minimum Low pulse width on INIT_B output
All
250
–ns
TICCK(3)
The time from the rising edge of the INIT_B pin to the
generation of the configuration clock signal at the CCLK
output pin
All
0.5
4
s
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 8. This means power must be applied to all VCCINT, VCCO,
and VCCAUX lines.
2.
Power-on reset and the clearing of configuration memory occurs during this period.
3.
This specification applies only to the Master Serial, SPI, and BPI modes.
VCCINT
(Supply)
VCCAUX
VCCO Bank 2
PROG_B
(Output)
(Open-Drain)
(Input)
INIT_B
CCLK
DS681_10_041111
1.2V
2.5V
T
ICCK
T
PROG
T
PL
T
POR
1.0V
2.0V
3.3V
or
Notes:
1.
The VCCINT, VCCAUX, and VCCO supplies can be applied in any order.
2.
The Low-going pulse on PROG_B is optional after power-on.
3.
The rising edge of INIT_B samples the voltage levels applied to the mode pins (M0–M2).
相关PDF资料
PDF描述
XC6SLX25T-3CSG324C IC FPGA SPARTAN 6 24K 324CSGBGA
XCV50E-6PQ240C IC FPGA 1.8V C-TEMP 240-PQFP
ABB50DHBS CONN EDGECARD 100PS R/A .050 SLD
XCV50E-6FG256C IC FPGA 1.8V C-TEMP 256-FBGA
XC6SLX25-L1CSG324I IC FPGA SPARTAN 6 24K 324CSGBGA
相关代理商/技术参数
参数描述
XA3S400A-4FGG400Q 功能描述:IC FPGA SPARTAN-3A 400K 400-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S400A-4FTG256I 功能描述:IC FPGA SPARTAN-3A 400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S400A-4FTG256Q 功能描述:IC FPGA SPARTAN-3A 400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S500E 制造商:XILINX 制造商全称:XILINX 功能描述:XA Spartan-3E Automotive FPGA Family Data Sheet
XA3S500E-4CPG132I 功能描述:IC FPGA SPARTAN-3E 500K 132CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)