- 您现在的位置：买卖IC网 > PDF目录157990 > 70T3399S133DD (INTEGRATED DEVICE TECHNOLOGY INC) 128K X 18 DUAL-PORT SRAM, 15 ns, PQFP144 PDF资料下载
参数资料
| 型号： | 70T3399S133DD |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | SRAM |
| 英文描述： | 128K X 18 DUAL-PORT SRAM, 15 ns, PQFP144 |
| 封装： | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 |
| 文件页数： | 19/28页 |
| 文件大小： | 429K |
| 代理商： | 70T3399S133DD |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页当前第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
6.42
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
26
Identification Register Definitions
System Interface Parameters
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS, and TRST.
3. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local
IDT sales representative.
NOTE:
1. Device ID for IDT70T3319 is 0x334. Device ID for IDT70T3399 is 0x335.
Instruction Field
Value
Description
Revision Number (31:28)
0x0
Reserved for version number
IDT Device ID (27:12)
0x333(1)
Defines IDT part number
IDT JEDEC ID (11:1)
0x33
Allows unique identification of device vendor as IDT
ID Register Indicator Bit (Bit 0)
1
Indicates the presence of an ID register
5652 tbl 16
Scan Register Sizes
Register Name
Bit Size
Instruction (IR)
4
Bypass (BYR)
1
Identification (IDR)
32
Boundary Scan (BSR)
Note (3)
5652 tbl 17
Instruction
Code
Description
EXTEST
0000
Forces contents of the boundary scan cells onto the device outputs(1).
Places the boundary scan register (BSR) between TDI and TDO.
BYPASS
1111
Places the bypass register (BYR) between TDI and TDO.
IDCODE
0010
Loads the ID register (IDR) with the vendor ID code and places the
register between TDI and TDO.
HIGHZ
0100
Places the bypass register (BYR) between TDI and TDO. Forces all
device output drivers to a High-Z state except COLx & INTx outputs.
CLAMP
0011
Uses BYR. Forces contents of the boundary scan cells onto the device
outputs. Places the bypass register (BYR) between TDI and TDO.
SAMPLE/PRELOAD
0001
Places the boundary scan register (BSR) between TDI and TDO.
SAMPLE allows data from device inputs(2) to be captured in the
boundary scan cells and shifted serially through TDO. PRELOAD allows
data to be input serially into the boundary scan cells via the TDI.
RESERVED
0101, 0111, 1000, 1001,
1010, 1011, 1100
Several combinations are reserved. Do not use codes other than those
identified above.
PRIVATE
0110,1110,1101
For internal use only.
5652 tbl 18
相关PDF资料 |
PDF描述 |
|---|---|
| 70TPS12 | 75 A, 1200 V, SCR, TO-274AA |
| 70TPS16 | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS16 | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS16PBF | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS12PBF | 75 A, 1200 V, SCR, TO-274AA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 70T3399S166BC | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 256-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 256BGA - Rail/Tube |
| 70T3399S166BC8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 256-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 256BGA - Tape and Reel |
| 70T3399S166BF | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 208-Pin FBGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 208FPBGA - Rail/Tube |
| 70T3399S166BF8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 208-Pin FBGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 208FPBGA - Tape and Reel |
| 70T3399S200BC | 功能描述:静态随机存取存储器 RoHS:否 制造商:IDT 存储容量: 组织: 访问时间: 电源电压-最大: 电源电压-最小: 最大工作电流: 最大工作温度: 最小工作温度: 安装风格: 封装 / 箱体: 封装: |
发布紧急采购，3分钟左右您将得到回复。