- 您现在的位置：买卖IC网 > PDF目录157990 > 70T3399S133DD (INTEGRATED DEVICE TECHNOLOGY INC) 128K X 18 DUAL-PORT SRAM, 15 ns, PQFP144 PDF资料下载
参数资料
| 型号： | 70T3399S133DD |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | SRAM |
| 英文描述： | 128K X 18 DUAL-PORT SRAM, 15 ns, PQFP144 |
| 封装： | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 |
| 文件页数： | 6/28页 |
| 文件大小： | 429K |
| 代理商： | 70T3399S133DD |
第1页第2页第3页第4页第5页当前第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
6.42
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
14
Timing Waveform of a Multi-Device Pipelined Read(1,2)
NOTES:
1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70T3339/19/99 for this waveform,
and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation.
2. UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and REPEAT = VIH.
Timing Waveform of a Multi-Device Flow-Through Read(1,2)
,
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tHA
CLK
Q0
Q1
Q3
DATAOUT(B1)
tCH2
tCL2
tCYC2
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
Q2
Q4
tCD2
tCKHZ
tCD2
tCKLZ
tDC
tCKHZ
tCD2
tCKLZ
tSC
tHC
tCKHZ
tCKLZ
tCD2
A6
tDC
tSC
tHC
tSC
tHC
5652 drw 07
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tH
A
CLK
5652 drw 08
D0
D3
tCD1
tCKLZ
tCKHZ
(1)
D1
DATAOUT(B1)
tCH1
tCL1
tCYC1
(1)
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
D2
D4
tCD1
tCKHZ
tDC
tCD1
tCKLZ
tSC
tHC
(1)
tCKHZ
(1)
tCKLZ
(1)
tCD1
A6
tDC
tSC
tHC
tSC
tHC
D5
tCD1
tCKLZ
(1)
tCKHZ
(1)
,
相关PDF资料 |
PDF描述 |
|---|---|
| 70TPS12 | 75 A, 1200 V, SCR, TO-274AA |
| 70TPS16 | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS16 | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS16PBF | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS12PBF | 75 A, 1200 V, SCR, TO-274AA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 70T3399S166BC | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 256-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 256BGA - Rail/Tube |
| 70T3399S166BC8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 256-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 256BGA - Tape and Reel |
| 70T3399S166BF | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 208-Pin FBGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 208FPBGA - Rail/Tube |
| 70T3399S166BF8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 12ns/3.6ns 208-Pin FBGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 12NS/3.6NS 208FPBGA - Tape and Reel |
| 70T3399S200BC | 功能描述:静态随机存取存储器 RoHS:否 制造商:IDT 存储容量: 组织: 访问时间: 电源电压-最大: 电源电压-最小: 最大工作电流: 最大工作温度: 最小工作温度: 安装风格: 封装 / 箱体: 封装: |
发布紧急采购，3分钟左右您将得到回复。