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参数资料
| 型号： | AGLN250V2-CS81 |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 6144 CLBS, 250000 GATES, 250 MHz, PBGA81 |
| 封装： | 5 X 5 MM, 0.8 MM HEIGHT, 0.5 MM PITCH, CSP-81 |
| 文件页数： | 119/140页 |
| 文件大小： | 4325K |
| 代理商： | AGLN250V2-CS81 |
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IGLOO nano Device Overview
1- 2
R ev isio n 1 0
IGLOO nano devices also have low dynamic power consumption to further maximize power savings;
power is reduced even further by the use of a 1.2 V core voltage.
Low dynamic power consumption, combined with low static power consumption and Flash*Freeze
technology, gives the IGLOO nano device the lowest total system power offered by any FPGA.
Security
Nonvolatile, flash-based IGLOO nano devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. IGLOO nano devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.
IGLOO nano devices utilize a 128-bit flash-based lock and a separate AES key to secure programmed
intellectual property and configuration data. In addition, all FlashROM data in IGLOO nano devices can
be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block cipher encryption
standard. AES was adopted by the National Institute of Standards and Technology (NIST) in 2000 and
replaces the 1977 DES standard. IGLOO nano devices have a built-in AES decryption engine and a
flash-based AES key that make them the most comprehensive programmable logic device security
solution available today. IGLOO nano devices with AES-based security allow for secure, remote field
updates over public networks such as the Internet, and ensure that valuable IP remains out of the hands
of system overbuilders, system cloners, and IP thieves. The contents of a programmed IGLOO nano
device cannot be read back, although secure design verification is possible.
Security, built into the FPGA fabric, is an inherent component of IGLOO nano devices. The flash cells are
located beneath seven metal layers, and many device design and layout techniques have been used to
make invasive attacks extremely difficult. IGLOO nano devices, with FlashLock and AES security, are
unique in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected
and secure, making remote ISP possible. An IGLOO nano device provides the most impenetrable
security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the
configuration data is an inherent part of the FPGA structure, and no external configuration data needs to
be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based IGLOO nano
FPGAs do not require system configuration components such as EEPROMs or microcontrollers to load
device configuration data. This reduces bill-of-materials costs and PCB area, and increases security and
system reliability.
Live at Power-Up
Actel flash-based IGLOO nano devices support Level 0 of the LAPU classification standard. This feature
helps in system component initialization, execution of critical tasks before the processor wakes up, setup
and configuration of memory blocks, clock generation, and bus activity management. The LAPU feature
of flash-based IGLOO nano devices greatly simplifies total system design and reduces total system cost,
often eliminating the need for CPLDs and clock generation PLLs. In addition, glitches and brownouts in
system power will not corrupt the IGLOO nano device's flash configuration, and unlike SRAM-based
FPGAs, the device will not have to be reloaded when system power is restored. This enables the
reduction or complete removal of the configuration PROM, expensive voltage monitor, brownout
detection, and clock generator devices from the PCB design. Flash-based IGLOO nano devices simplify
total system design and reduce cost and design risk while increasing system reliability and improving
system initialization time.
IGLOO nano flash FPGAs enable the user to quickly enter and exit Flash*Freeze mode. This is done
almost instantly (within 1 s) and the device retains configuration and data in registers and RAM. Unlike
SRAM-based FPGAs, the device does not need to reload configuration and design state from external
memory components; instead it retains all necessary information to resume operation immediately.
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike
SRAM-based FPGAs, flash-based IGLOO nano devices allow all functionality to be live at power-up; no
external boot PROM is required. On-board security mechanisms prevent access to all the programming
information and enable secure remote updates of the FPGA logic. Designers can perform secure remote
in-system reprogramming to support future design iterations and field upgrades with confidence that
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AGLN250V2-CSG81 | 功能描述:IC FPGA 250K 1.2-1.5V CSP81 RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28） |
| AGLN250V2-CSG81I | 功能描述:IC FPGA NANO 1KB 250K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| AGLN250V2-DIELOT | 制造商:Microsemi Corporation 功能描述:AGLN250V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:Microsemi SOC Products Group 功能描述:AGLN250V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film |
| AGLN250V2-QNG100I | 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO FAMILY 250K GATES 130NM (CMOS) TECHNOLOGY 1. - Trays |
| AGLN250V2-VQ100 | 功能描述:IC FPGA NANO 1KB 250K 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
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