参数资料
型号: APA300-FGG144
厂商: Microsemi SoC
文件页数: 99/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 300K 144-FBGA
标准包装: 160
系列: ProASICPLUS
RAM 位总计: 73728
输入/输出数: 100
门数: 300000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 144-LBGA
供应商设备封装: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
v5.9
2-17
Logic Tile Timing Characteristics
Timing characteristics for ProASICPLUS devices fall into
three categories: family dependent, device dependent,
and design dependent. The input and output buffer
characteristics are common to all ProASICPLUS family
members. Internal routing delays are device dependent.
Design dependency means that actual delays are not
determined until after placement and routing of the
user’s design are complete. Delay values may then be
determined by using the Timer utility or by performing
simulation with post-layout delays.
Critical Nets and Typical Nets
Propagation delays are expressed only for typical nets,
which are used for initial design performance evaluation.
Critical net delays can then be applied to the most
timing-critical paths. Critical nets are determined by net
property assignment prior to place-and-route. Refer to
the Actel Designer User’s Guide or online help for details
on using constraints.
Timing Derating
Since ProASICPLUS devices are manufactured with a
CMOS process, device performance will vary with
temperature, voltage, and process. Minimum timing
parameters
reflect
maximum
operating
voltage,
minimum operating temperature, and optimal process
variations. Maximum timing parameters reflect minimum
operating voltage, maximum operating temperature,
and
worst-case
process
variations
(within
process
specifications). The derating factors shown in Table 2-9
should be applied to all timing data contained within
this datasheet.
All timing numbers listed in this datasheet represent
sample timing characteristics of ProASICPLUS devices.
Actual timing delay values are design-specific and can be
derived from the Timer tool in Actel’s Designer software
after place-and-route.
Table 2-9
Temperature and Voltage Derating Factors
(Normalized to Worst-Case Commercial, TJ = 70°C, VDD = 2.3 V)
–55°C
–40°C
0°C
25°C
70°C
85°C
110°C
125°C
135°C
150°C
2.3 V
0.84
0.860.910.941.001.021.05
1.13
1.181.27
2.5 V
0.81
0.820.870.900.950.981.01
1.09
1.131.21
2.7 V
0.77
0.790.830.860.910.930.96
1.04
1.081.16
Notes:
1. The user can set the junction temperature in Designer software to be any integer value in the range of –55°C to 175°C.
2. The user can set the core voltage in Designer software to be any value between 1.4 V and 1.6 V.
相关PDF资料
PDF描述
A42MX24-FPQ160 IC FPGA MX SGL CHIP 36K 160-PQFP
A42MX24-FPQG160 IC FPGA MX SGL CHIP 36K 160-PQFP
A54SX08-PLG84I IC FPGA SX 12K GATES 84-PLCC
A54SX08-PL84I IC FPGA SX 12K GATES 84-PLCC
A54SX08-1PLG84 IC FPGA SX 12K GATES 84-PLCC
相关代理商/技术参数
参数描述
APA300-FGG144A 功能描述:IC FPGA PROASIC+ 300K 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
APA300-FGG144I 功能描述:IC FPGA PROASIC+ 300K 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
APA300-FGG144M 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 300K GATES 180MHZ 0.22UM 2.5V 144FBGA - Trays
APA300-FGG256 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
APA300-FGG256A 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)