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参数资料
| 型号： | BX80524P300000 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 300 MHz, MICROPROCESSOR, PPGA370 |
| 封装： | 1.950 X 1.950 INCH, HEAT SINK, STAGGERED, PLASTIC, PGA-370 |
| 文件页数： | 2/88页 |
| 文件大小： | 1622K |
| 代理商： | BX80524P300000 |
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Intel Celeron Processor
10
Datasheet
1.1.1
Package Terminology
The following terms are used often in this document and are explained here for clarification:
Processor substrate—The structure on which passive components (resistors and capacitors)
are mounted.
Processor core—The processor’s execution engine.
S.E.P. Package—Single-Edge Processor Package, which consists of a processor substrate,
processor core, and passive components. This package differs from the S.E.C. Cartridge as this
processor has no external plastic cover, thermal plate, or latch arms.
PPGA package—Plastic Pin Grid Array package. The package is a pinned laminated printed
circuit board structure.
Additional terms referred to in this and other related documentation:
SC242—242-contact slot connector. A processor in the S.E.P. Package uses this connector to
interface with a system board.
370-pin socket (PGA370)—The zero insertion force (ZIF) socket in which a processor in the
PPGA package will use to interface with a system board.
Retention mechanism—A mechanical assembly which holds the package in the SC242
connector.
1.2
References1,2
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
Intel Celeron Processor Support Component Suppliers
(http://developer.intel.com/design/celeron/componets/)
AP-485, Intel Processor Identification and the CPUID Instruction (Order Number 241618)
AP-585, Pentium II Processor AGTL+ Guidelines (Order Number 243330)
AP-586, Pentium II Processor Thermal Design Guidelines (Order Number 243331)
AP-587, Pentium II Processor Power Distribution Guidelines (Order Number 243332)
AP-589, Design for EMI (Order Number 243334)
Pentium II Processor at 233, 266, 300, and 333 MHz Datasheet (Order Number 243335)
Pentium II Processor at 350, 400, and 450 MHz Datasheet (Order Number 243657)
Intel Celeron Processor Specification Update (Order Number 243337)
SC242 Connector Design Guidelines (Order Number 243397)
Pentium II Processor Developer’s Manual (Order Number 243502)
370-Pin Socket (PGA370) Design Guidelines (Order Number 244410)
Intel Architecture Software Developer's Manual (Order Number 243193)
— Volume I: Basic Architecture (Order Number 243190)
— Volume II: Instruction Set Reference (Order Number 243191)
— Volume III: System Programming Guide (Order Number 243192)
Pentium II Processor I/O Buffer Models, Quad XTK Format (Electronic Form)
Intel 440EX AGPset Design Guide (Order Number 290637)
Intel Celeron Processor with the Intel 440LX AGPset Design Guide (Order Number
245088)
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