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参数资料
| 型号： | BX80532RC2300B |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2300 MHz, MICROPROCESSOR |
| 文件页数： | 2/99页 |
| 文件大小： | 4142K |
| 代理商： | BX80532RC2300B |
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10
Datasheet
Introduction
1.1.1
Processor Packaging Terminology
The following are commonly used terms:
Intel Celeron processor on 0.13 micron process and in the 478-pin package (also
referred as the Intel Celeron processor on 0.13 micron process or processor) —
0.13 micron processor core in the 478-pin FC-PGA2 package with a 128-KB L2 cache.
Intel Celeron processor in the 478-pin package — 0.18 micron processor core in the
478-pin FC-PGA2 package with a 128-KB L2 cache.
Intel Pentium 4 processor with 512-KB L2 cache on 0.13 micron process —
0.13 micron process version of Pentium 4 processor in the 478-pin FC-PGA2 package with a
512-KB L2 cache.
Processor — For this document, the term processor means Celeron processor on 0.13 micron
process.
Keep-Out Zone — The area on or near the processor that system design can not utilize. This
area must be kept free of all components to make room for the processor package, retention
mechanism, heatsink, and heatsink clips.
Intel 850 chipset — Chipset that supports RDRAM* memory technology for Celeron
processor on 0.13 micron process.
Intel 845 chipset — Chipset that supports PC133 and DDR memory technology for the
Celeron processor on 0.13 micron process.
Intel 845G chipset — Chipset with embedded graphics that supports DDR memory
technology for the Celeron processor on 0.13 micron process.
Intel 845E chipset — Chipset that supports DDR memory technology for the Celeron
processor on 0.13 micron process.
Processor core — Celeron processor on 0.13 micron process core die with integrated
L2 cache.
FC-PGA2 package — Flip-Chip Pin Grid Array package with 50-mil pin pitch and Integrated
Heat Spreader.
mPGA478B socket — Surface mount, 478 pin, Zero Insertion Force (ZIF) socket with 50-mil
pin pitch. The socket mates the processor to the system board.
Integrated heat spreader — The surface used to make contact between a heatsink or other
thermal solution and the processor. Abbreviated IHS.
Retention mechanism — The structure mounted on the system board that provides support
and retention of the processor heatsink.
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PDF描述 |
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| BU-65743F8-310 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP80 |
| BU-61559D1-390Z | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
| BU-61559D1-620Q | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
| BU-61559D2-330Z | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80532RC2500B | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 0.13UM 2.5GHZ 478-PIN FCPGA2 - Boxed Product (Development Kits) |
| BX80532RC2600B | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 0.13UM 2.6GHZ - Boxed Product (Development Kits) |
| BX80532RC2800B | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 0.13UM 2.8GHZ - Boxed Product (Development Kits) |
| BX80536NC1700EJ | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 390 RISC 64-BIT 90NM 1.7GHZ 1.05V - Boxed Product (Development Kits) |
| BX80537T5500 S L9SH | 制造商:Intel 功能描述:MPU Core?2 Duo Processor T5500 64-Bit 65nm 1.66GHz 1.05V 478-Pin FCPGA6 |
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