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参数资料
| 型号： | BX80532RC2300B |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2300 MHz, MICROPROCESSOR |
| 文件页数： | 50/99页 |
| 文件大小： | 4142K |
| 代理商： | BX80532RC2300B |
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54
Datasheet
Package Mechanical Specifications
NOTES:
1. Flatness is specified as overall, not per unit of length.
2. All Dimensions are in millimeters.
4.1
Package Load Specifications
Table 31 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heatsink assembly, mechanical stress testing, or standard
drop and shipping conditions. The heatsink attach solutions must not induce continuous stress onto
the processor with the exception of a uniform load to maintain the heatsink-to-processor thermal
interface contact. It is not recommended to use any portion of the processor substrate as a
mechanical reference or load bearing surface for thermal solutions.
NOTES:
1. This specification applies to a uniform compressive load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. Dynamic loading specifications are defined assuming a maximum duration of 11 ms and 200 lbf is achieved
by superimposing a 100 lbf dynamic load (1 lbm at 50 g) on the static compressive load.
Figure 31. IHS Flatness Specification
SUBSTRATE
IHS
SUBSTRATE
IHS
Table 31. Package Dynamic and Static Load Specifications
Parameter
Max
Unit
Notes
Static
100
lbf
1, 2
Dynamic
200
lbf
1, 3
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