参数资料
型号: BX80532RC2300B
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2300 MHz, MICROPROCESSOR
文件页数: 47/99页
文件大小: 4142K
代理商: BX80532RC2300B
Datasheet
51
Package Mechanical Specifications
4.0
Package Mechanical Specifications
The Celeron processor on 0.13 micron process is packaged in a Flip-Chip Pin Grid Array (FC-
PGA2) package. Components of the package include an integrated heat spreader (IHS), processor
die, and the substrate that is the pin carrier. Mechanical specifications for the processor are given in
this section. See Section 1.1. for a listing of terminology. The processor socket that accepts the
Celeron processor on 0.13 micron process is referred to as a 478-Pin micro PGA (mPGA478B)
socket. See the Intel Pentium 4 Processor 478-pin Socket (mPGA478B) Design Guidelines for
complete details on the mPGA478B socket.
Note:
The following notes apply to Figure 27 through Figure 34:
1. Unless otherwise specified, the following drawings are dimensioned in millimeters.
2. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference dimensions are not
checked as part of the processor manufacturing process. Unless noted as such, dimensions in
parentheses without tolerances are reference dimensions.
3. Drawings are not to scale.
Note:
Figure 27 is not to scale and is for reference only. The socket and system board are supplied as a
reference only.
Figure 27. Exploded View of Processor Components on a System Board
System board
mPGA478B
31 mm
Heat Spreader
Substrate
35mm square
3.5m m
2.0m m
478 pins
Socket
相关PDF资料
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BU-65743F8-310 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP80
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