参数资料
型号: C8051F300-TB
厂商: Silicon Laboratories Inc
文件页数: 170/178页
文件大小: 0K
描述: BOARD PROTOTYPING W/C8051F300
标准包装: 1
类型: MCU
适用于相关产品: C8051F300
所含物品:
Table 10.2. Security Byte Decoding
Bits
Description
Write Lock: Clearing any of these bits to logic 0 prevents all Flash
memory from being written or page-erased across the C2 interface
Read/Write Lock: Clearing any of these bits to logic 0 prevents all
Flash memory from being read, written, or page-erased across the
C2 interface.
Rev. 2.9
91
C8051F300/1/2/3/4/5
The lock bits can always be read and cleared to logic 0 regardless of the security settings.
Important note: The only means of removing a lock (write or read/write) once set is to erase the
entire program memory space via a C2 Device Erase command.
C8051F300/1/2/3
0x0000
0x1DFF
Lock Byte
Reserved
0x1DFE
FLASH memory
organized in 512-byte
pages
0x1E00
0x0000
0x0FFF
Reserved
0x0FFE
FLASH memory
organized in 512-byte
pages
0x1000
0x0000
0x07FF
Lock Byte
Reserved
0x07FE
FLASH memory
organized in 512-byte
pages
0x0800
Lock Byte
C8051F304
C8051F305
Figure 10.1. Flash Program Memory Map
The level of Flash security depends on the Flash access method. The three Flash access methods that
can be restricted are reads, writes, and erases from the C2 debug interface, user firmware executing on
unlocked pages, and user firmware executing on locked pages.
Accessing Flash from the C2 debug interface:
1.
Any unlocked page may be read, written, or erased.
2.
Locked pages cannot be read, written, or erased.
3.
The page containing the Lock Byte may be read, written, or erased if it is unlocked.
4.
Reading the contents of the Lock Byte is always permitted only if no pages are locked.
5.
Locking additional pages (changing ‘1’s to ‘0’s in the Lock Byte) is not permitted.
6.
Unlocking Flash pages (changing ‘0’s to ‘1’s in the Lock Byte) requires the C2 Device Erase com-
mand, which erases all Flash pages including the page containing the Lock Byte and the Lock
Byte itself.
7.
The Reserved Area cannot be read, written, or erased.
7–4
3–0
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C8051F301 功能描述:8位微控制器 -MCU 8KB 2%osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
C8051F301-GM 功能描述:8位微控制器 -MCU 8KB 11P MCU RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
C8051F301-GMR 功能描述:8位微控制器 -MCU 8KB 11P MCU RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
C8051F301-GS 功能描述:8位微控制器 -MCU 8KB Flash 2%osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT