参数资料
型号: EM250-RCM-R
厂商: Silicon Laboratories Inc
文件页数: 112/124页
文件大小: 0K
描述: EM250 RCM BOARD
标准包装: 12
类型: 收发器,802.15.4/Zigbee
频率: 2.4GHz
适用于相关产品: EM250
其它名称: 636-1023
EM250
9 QFN48 Footprint Recommendations
Figure 19 demonstrates the IPC-7351 recommended PCB Footprint for the EM250 (QFN50P700X700X90-49N). A
ground pad in the bottom center of the package forms a 49 th pin.
A 3 x 3 array of non-thermal vias should connect the EM250 decal center shown in Figure 19 to the PCB ground
plane through the ground pad. In order to properly solder the EM250 to the footprint, the Paste Mask layer
should have a 3 x 3 array of circular openings at 1.015mm diameter spaced approximately 1.625mm (center to
center) apart, as shown in Figure 20. This will cause an evenly distributed solder flow and coplanar
attachment to the PCB. The solder mask layer (illustrated in Figure 21) should be the same as the copper layer
for the EM250 footprint.
For more information on the package footprint, please refer to the Silicon Labs EM250 Reference Design .
Figure 19. PCB Footprint for the EM250
Figure 20. Paste Mask Dimensions
120-0082-000V Rev 1.1
Page 112
Figure 21. Solder Mask Dimensions
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