参数资料
型号: FDMA291P
厂商: Fairchild Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET P-CH 20V 6.6A MFET 2X2
产品培训模块: High Voltage Switches for Power Processing
产品目录绘图: MicroFET 2x2, SC-75 Single
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 6.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 42 毫欧 @ 6.6A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 14nC @ 4.5V
输入电容 (Ciss) @ Vds: 1000pF @ 10V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-MicroFET(2x2)
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDMA291PDKR
April 2009
FDMA291P
Single P-Channel 1.8V Specified PowerTrench MOSFET
tm
General Description
Features
This device is designed specifically for battery charge
or load switching in cellular handset and other ultra-
portable applications. It features a MOSFET with low
–6.6 A, –20V. r DS(ON) = 42 m
r DS(ON) = 58 m
r DS(ON) = 98 m
@ V GS = –4.5V
@ V GS = –2.5V
@ V GS = –1.8V
on-state resistance.
The MicroFET 2x2 package offers exceptional thermal
performance for its physical size and is well suited to
linear mode applications.
Low profile – 0.8 mm maximum – in the new package
MicroFET 2x2 mm
Free from halogenated compounds and antimony
oxides
RoHS Compliant
Pin 1
Drain
D
D
D
D
S
G
Source
D 1
D 2
G 3
Bottom Drain Contact
6 D
5 D
4 S
MicroFET 2x 2
T A =25 C unless otherwise noted
Absolute Maximum Ratings
o
Symbol
V DS
V GS
Parameter
Drain-Source Voltage
Gate-Source Voltage
Ratings
–20
8
Units
V
V
I D
Drain Current
– Continuous
– Pulsed
(Note 1a)
–6.6
–24
A
P D
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
2.4
0.9
W
T J , T STG
Operating and Storage Junction Temperature Range
–55 to +150
C
Thermal Characteristics
R
R
JA
JA
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
(Note 1a)
(Note 1b)
52
145
C/W
Package Marking and Ordering Information
Device Marking
291
Device
FDMA291P
Reel Size
7’’
Tape width
8mm
Quantity
3000 units
2009 Fairchild Semiconductor Corporation
FDMA291P Rev B4
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