参数资料
型号: FDMA291P
厂商: Fairchild Semiconductor
文件页数: 2/6页
文件大小: 0K
描述: MOSFET P-CH 20V 6.6A MFET 2X2
产品培训模块: High Voltage Switches for Power Processing
产品目录绘图: MicroFET 2x2, SC-75 Single
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 6.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 42 毫欧 @ 6.6A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 14nC @ 4.5V
输入电容 (Ciss) @ Vds: 1000pF @ 10V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-MicroFET(2x2)
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDMA291PDKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Off Characteristics
BV DSS
BV DSS
T J
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
V GS = 0 V, I D = –250 A
I D = –250 A, Referenced to 25°C
–20
–12
V
mV/ C
I DSS
I GSS
Zero Gate Voltage Drain Current
Gate–Body Leakage
V DS = –16 V,
V GS = ± 8 V,
V GS = 0 V
V DS = 0 V
–1
±100
A
nA
On Characteristics
(Note 2)
V GS(th)
V GS(th)
T J
r DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
V DS = V GS , I D = –250 A
I D = –250 A, Referenced to 25°C
V GS = –4.5 V, I D = –6.6 A
–0.4
–0.7
3
36
–1.0
42
V
mV/ C
m
On–Resistance
V GS = –2.5 V, I D = –5.1 A
V GS = –1.8 V, I D = –3.9 A
V GS = –4.5 V, I D = –6.6 A, T J =125°C
51
79
49
58
98
64
g FS
Forward Transconductance
V DS = –5 V,
I D = –6.6 A
16
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –10 V,
f = 1.0 MHz
V GS = 0 V,
1000
190
100
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
V DD = –10 V, I D = –1 A,
V GS = –4.5 V, R GEN = 6
13
9
42
25
23
18
68
40
ns
ns
ns
ns
Q g
Q gs
Total Gate Charge
Gate–Source Charge
V DS = –10 V,
V GS = –4.5 V
I D = –6.6 A,
10
2
14
nC
nC
Q gd
Gate–Drain Charge
3
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
–2
A
V SD
Drain–Source Diode Forward
V GS = 0 V, I S = –2 A
(Note 2)
–0.8
–1.2
V
Voltage
t rr
Q rr
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
I F = –6.6 A,
dI F /dt = 100 A/μs
20
8
ns
nC
Notes:
1. R JA is determined with the device mounted on a 1 in 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
JC
is guaranteed by design while R
JA
is
determined by the user's board design.
a. 5 2 °C/W when mounted
on a 1 in 2 pad of 2 oz copper.
b. 145 °C/W when mounted on a
minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%
FDMA291P Rev B4
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