参数资料
型号: FDMA430NZ
厂商: Fairchild Semiconductor
文件页数: 2/7页
文件大小: 0K
描述: MOSFET N-CH 30V 5A MICROFET
产品目录绘图: MicroFET 2x2, SC-75 Single
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 5A
开态Rds(最大)@ Id, Vgs @ 25° C: 40 毫欧 @ 5A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 11nC @ 4.5V
输入电容 (Ciss) @ Vds: 800pF @ 10V
功率 - 最大: 2.4W
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-MicroFET(2x2)
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDMA430NZDKR
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
B VDSS
' B VDSS
' T J
I DSS
I GSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage,
V GS = 0V , I D = 250 P A
I D = 250 P A,
Referenced to 25°C
V DS = 24V, V GS = 0V,
V GS = r 12V, V DS = 0V
30
25.2
1
r 10
V
mV/°C
P A
P A
On Characteristics (Note 2)
V GS(th)
' V GS(th)
' T J
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
V DS = V GS , I D = 250 P A
I D = 250 P A,
Referenced to 25°C
0.6
0.81
-3.2
1.5
V
mV/°C
V GS = 4.5V, I D = 5.0A
V GS = 4.0V, I D = 5.0A
23.6
23.9
40
41
R DS(ON)
Static Drain-Source On-Resistance
V GS = 3.1V, I D =4.5A
V GS = 2.5V, I D =4.5A
25.4
27.6
43
50
m :
V GS = 4.5V, I D =5.0A,
T J =150°C
37.0
61
g FS
Forward Transconductance
V DS = 5V, I D =5.0A
25.6
S
Dynamic Characteristics
C iss
C oss
C rss
R G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 10V, V GS =0V,
f = 1.0MHz
f = 1.0MHz
600
110
75
3.5
800
150
115
pF
pF
pF
:
Switching Characteristics (Note 2)
t d(on)
Turn-On Delay Time
8.3
17
ns
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 10V, I D = 1A
V GS = 4.5V, R GEN = 6 :
V DS = 10V, I D = 5.0A,
V GS = 4.5V
7.1
18.1
6.0
7.3
0.8
1.9
15
37
12
11
2
3
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain-Source Diode Forward Current
2.0
A
V SD
t rr
Q rr
Drain-Source Diode Forward Voltage
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
V GS = 0V, I S = 2.0A
I F = 5.0A,
di/dt = 100A/ P s
0.69
1.2
17
5
V
ns
nC
Notes:
1. R T JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder
mounting surface of the drain pins.
a. 5 2 °C/W when mounted
on a 1 in 2 pad of 2 oz copper.
b. 145 °C/W when mounted on a
minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 P s, Duty Cycle < 2.0%
3. The diode connected between the gate and the source serves only as proection against ESD. No gate overvoltage rating is implied.
FDMA430NZ Rev B 5
2
www.fairchildsemi.com
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