参数资料
型号: FDMC8200
厂商: Fairchild Semiconductor
文件页数: 1/11页
文件大小: 0K
描述: MOSFET 2N-CH 30V 8A/12A POWER33
产品目录绘图: 8-MLP, Power33, 56 Dual
特色产品: FDMC8200 Dual MOSFET for Synchronous Buck Designs
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 8A,12A
开态Rds(最大)@ Id, Vgs @ 25° C: 20 毫欧 @ 6A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 10V
输入电容 (Ciss) @ Vds: 660pF @ 15V
功率 - 最大: 700mW,900mW
安装类型: 表面贴装
封装/外壳: 8-PowerVDFN
供应商设备封装: 8-Power33(3x3)
包装: 标准包装
其它名称: FDMC8200DKR
June 2009
FDMC8200
Dual N-Channel PowerTrench ? MOSFET
30 V, 9.5 m ? and 20 m ?
Features
Q1: N-Channel
Max r DS(on) = 20 m ? at V GS = 10 V, I D = 6 A
Max r DS(on) = 32 m ? at V GS = 4.5 V, I D = 5 A
Q2: N-Channel
Max r DS(on) = 9.5 m ? at V GS = 10 V, I D = 9 A
Max r DS(on) = 13.5 m ? at V GS = 4.5 V, I D = 7 A
RoHS Compliant
General Description
This device includes two specialized N-Channel MOSFETs in a
dual Power33 (3mm x 3mm MLP) package. The switch node
has been internally connected to enable easy placement and
routing of synchronous buck converters. The control
MOSFET (Q1) and synchronous MOSFET (Q2) have been
designed to provide optimal power efficiency.
Applications
Mobile Computing
Mobile Internet Devices
General Purpose Point of Load
DE
NO
ITC
GN
DG
Pin 1
G1
D1
D1
D1
D1
D2/S1
G2
S2
S2
S2
G HS
V IN
V IN
V IN
V IN
H
SW
G LS
D
GN
ND
S2
S2
S2
G2
5
6
7
8
Q2
Q1
4 D1
3 D1
2 D1
1 G1
BOTTOM
BOTTOM
Power 33
MOSFET Maximum Ratings T C = 25 °C unless otherwise noted
Symbol
V DS
Drain to Source Voltage
Parameter
Q1
30
Q2
30
Units
V
V GS
I D
Gate to Source Voltage
Drain Current - Continuous (Package limited)
- Continuous (Silicon limited)
- Continuous
(Note 3)
T C = 25 °C
T C = 25 °C
T A = 25 °C
±20
18
23
8 1a
±20
18
45
12 1b
V
A
- Pulsed
40
40
P D
Power Dissipation
Power Dissipation
T A = 25 °C
T A = 25 °C
1.9 1a
0.7 1c
2.2 1b
0.9 1d
W
T J , T STG
Operating and Storage Junction Temperature Range
-55 to +150
°C
Thermal Characteristics
R θ JA
Thermal Resistance, Junction to Ambient
65 1a
55 1b
R θ JA
Thermal Resistance, Junction to Ambient
180
1c
145 1d
°C/W
R θ JC
Thermal Resistance, Junction to Case
7.5
4
Package Marking and Ordering Information
Device Marking
FDMC8200
Device
FDMC8200
Package
Power 33
Reel Size
13 ”
Tape Width
12 mm
Quantity
3000 units
?2009 Fairchild Semiconductor Corporation
FDMC8200 Rev.A1
1
www.fairchildsemi.com
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