参数资料
型号: FDMC8200S
厂商: Fairchild Semiconductor
文件页数: 5/12页
文件大小: 0K
描述: MOSFET N-CH DUAL 30V 8MLP
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6A
开态Rds(最大)@ Id, Vgs @ 25° C: 20 毫欧 @ 6A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 10V
输入电容 (Ciss) @ Vds: 660pF @ 15V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-MLP(3.3X3.3),Power33
包装: 标准包装
其它名称: FDMC8200SDKR
Typical Characteristics (Q1 N-Channel) T J = 25°C unless otherwise noted
10
8
I D = 6 A
1000
C iss
6
4
2
V DD = 15 V
V DD = 10 V
V DD = 20 V
100
f = 1 MHz
V GS = 0 V
C oss
C rss
0
0
2
4
6
8
10
0.1
1
10
30
R θ JC = 7.5 C/W
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics
8
7
6
5
4
T J = 25 o C
3
25
20
15
V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance vs Drain
to Source Voltage
V GS = 10 V
Limited by Package
o
2
T J
= 100 o C
10
V GS = 4.5 V
T J = 125 o C
5
1
0.01
0.1
1
7
0
25
50
75
100
125
150
T c , CASE TEMPERATURE ( C )
10
100 us us
50
100
10
t AV , TIME IN AVALANCHE (ms)
Figure 9. Unclamped Inductive
Switching Capability
100
o
Figure 10. Maximum Continuous Drain
Current vs Case Temperature
100
V GS = 10 V
10 100 ms
1 s 10 s
SINGLE PULSE
T J = MAX RATED MAX RATED
T J =
125 o C/W
o R
C/W =
R θ JA = 180
DC
T C = 25 o C T A = 25 C
1
1
0.1
0.1
0.01
0.01
0.001 0.01
0.01
1 ms
1 ms
10 ms
r r
THIS AREA IS IS ms
LIMITED BY BY DS(on)
100 ms
SINGLE PULSE
DC
10 s
θ JA
o
0.1 1 10 100200
0.1 1 10 100200
V DS , DRAIN to SOURCE VOLTAGE (V)
V DS , DRAIN to SOURCE VOLTAGE (V)
10
1
0.1
0.001
0.01
0.1 1
t, PULSE WIDTH (sec)
SINGLE PULSE
R θ JA = 125 o C/W
T A = 25 o C
10 100
1000
Figure 11. Forward Bias Safe
Operating Area
Figure 12. Single Pulse Maximum
Power Dissipation
?2011 Fairchild Semiconductor Corporation
FDMC8200S Rev.C4
5
www.fairchildsemi.com
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