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| 型号： | FDN306P |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/5页 |
| 文件大小： | 0K |
| 描述： | MOSFET P-CH 12V 2.6A SSOT3 |
| 产品培训模块： | High Voltage Switches for Power Processing |
| 产品变化通告： | Wire Bonding Change 07/Nov/2008 Mold Compound Change 08/April/2008 |
| 产品目录绘图： | SuperSOT-3, SOT-23 |
| 标准包装： | 1 |
| 系列： | PowerTrench® |
| FET 型： | MOSFET P 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 12V |
| 电流 - 连续漏极(Id) @ 25° C： | 2.6A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 40 毫欧 @ 2.6A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1.5V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 17nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 1138pF @ 6V |
| 功率 - 最大： | 460mW |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-236-3，SC-59，SOT-23-3 |
| 供应商设备封装： | 3-SSOT |
| 包装： | 标准包装 |
| 产品目录页面： | 1602 (CN2011-ZH PDF) |
| 其它名称： | FDN306PDKR |
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage
V GS = 0 V,
I D = –250 μ A
–12
V
? BV DSS
? T J
I DSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
I D = –250 μ A,Referenced to 25 ° C
V DS = –10 V, V GS = 0 V
–3
–1
mV/ ° C
μ A
I GSSF
I GSSR
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
V GS = 8 V,
V GS = –8 V,
V DS = 0 V
V DS = 0 V
100
–100
nA
nA
On Characteristics
(Note 2)
V GS(th)
Gate Threshold Voltage
V DS = V GS ,
I D = –250 μ A
–0.4
–0.6
–1.5
V
? V GS(th)
? T J
R DS(on)
I D(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
I D = –250 μ A,Referenced to 25 ° C
V GS = –4.5 V, I D = –2.6 A
V GS = –2.5 V, I D = –2.3 A
V GS = –1.8V, I D = –1.8 A
V GS = –4.5 V, I D = –2.6A , T J =125 ° C
V GS = –4.5 V, V DS = –5 V
–10
2.5
30
39
54
40
40
50
80
54
mV/ ° C
m ?
A
g FS
Forward Transconductance
V DS = –5 V,
I D = –2.6 A
10
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –6 V,
f = 1.0 MHz
V GS = 0 V,
1138
454
302
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
V DD = –6 V,
V GS = –4.5 V,
V DS = –6 V,
V GS = –4.5 V
I D = –1 A,
R GEN = 6 ?
I D = –2.6 A,
11
10
38
35
12
2
20
20
61
56
17
ns
ns
ns
ns
nC
nC
Q gd
Gate–Drain Charge
3
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Sourc e Diode Forward Current
–0.42
A
V SD
Drain–Source Diode Forward
Voltage
V GS = 0 V,
I S = –0.42
(Note 2)
–0.6
–1.2
V
Notes:
1.
R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 250 ° C/W when mounted on a
0.02 in 2 pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
b) 270°C/W when mounted on a
minimum pad.
2.
Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDN306P Rev D W)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FDN306P | 制造商:Fairchild Semiconductor Corporation 功能描述:MOSFET |
| FDN306P_G | 制造商:Fairchild 功能描述:MOSET , -12V/2.6A, SSOT3 |
| FDN306P-CUT TAPE | 制造商:FAIRCHILD 功能描述:FDN306P Series 12 V 40 mOhm P-Channel 1.8V Specified PowerTrench Mosfet SSOT-3 |
| FDN308P | 功能描述:MOSFET P-Ch PowerTrench Specified 2.5V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| FDN308P | 制造商:Fairchild Semiconductor Corporation 功能描述:MOSFET |
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