参数资料
型号: FDS8858CZ
厂商: Fairchild Semiconductor
文件页数: 3/10页
文件大小: 0K
描述: MOSFET DUAL N/P-CHAN 30V SO-8
产品变化通告: Mold Compound Change 12/Dec/2007
产品目录绘图: Power MOSFET, 8-SOP, SO-8
标准包装: 1
系列: PowerTrench®
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 8.6A,7.3A
开态Rds(最大)@ Id, Vgs @ 25° C: 17 毫欧 @ 8.6A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 24nC @ 10V
输入电容 (Ciss) @ Vds: 1205pF @ 15V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: SO-8
包装: 标准包装
产品目录页面: 1604 (CN2011-ZH PDF)
其它名称: FDS8858CZDKR
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Type
Min
Typ
Max
Units
Drain-Source Diode Characteristics
V SD
t rr
Q rr
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V GS = 0V, I S = 8.6A
V GS = 0V, I S = -7.3A
Q1
I F = 8.6A, di/dt = 100A/s
Q2
I F = -7.3A, di/dt = 100A/s
(Note 2)
(Note 2)
Q1
Q2
Q1
Q2
Q1
Q2
0.8
0.9
25
28
19
22
1.2
-1.2
38
42
29
33
V
ns
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
R θ JC is guaranteed by design while R θ CA is determined by the user ’s board design.
a) 78°C/W when
mounted on a 0.5 in 2
pad of 2 oz copper
b) 125°C/W when
mounted on a 0.02 in 2
pad of 2 oz copper
c) 135°C/W when
mounted on a
minimun pad
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty cycle < 2.0%.
3. Starting T J = 25°C, N-ch: L = 1mH, I AS = 10A, V DD = 27V, V GS = 10V; P-ch: L = 1mH, I AS = -4.7A, V DD = -27V, V GS = -10V.
?2011 Fairchild Semiconductor Corporation
FDS8858CZ Rev.C
3
www.fairchildsemi.com
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