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参数资料
| 型号： | FDS8949_F085 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 40V DUAL 8-SOIC |
| 标准包装： | 1 |
| 系列： | PowerTrench® |
| FET 型： | 2 个 N 沟道（双） |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 40V |
| 电流 - 连续漏极(Id) @ 25° C： | 6A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 29 毫欧 @ 6A，10V |
| Id 时的 Vgs(th)（最大）： | 3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 11nC @ 5V |
| 输入电容 (Ciss) @ Vds： | 955pF @ 20V |
| 功率 - 最大： | 900mW |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 标准包装 |
| 其它名称： | FDS8949_F085DKR |
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
Drain to Source Breakdown Voltage I D = 250 μ A, V GS = 0V
40
V
? BV DSS
? T J
I DSS
I GSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = 250 μ A, referenced to 25°C
V DS = 32V, V GS = 0V
T J = 55 ° C
V GS = ±20V,V DS = 0V
33
1
10
±100
mV/° C
μ A
μ A
nA
On Characteristics (Note 2)
V GS(th)
? V GS(th )
? T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = 250 μ A
I D = 250 μ A, referenced to 25°C
1
1.9
-4.6
3
V
mV/°C
V GS = 10V, I D = 6A
21
29
r DS(on)
Drain to Source On Resistance
V GS = 4.5V, I D = 4.5A
26
36
m ?
V GS = 10V, I D = 6A,T J = 125°C
29
43
g FS
Forward Transconductance
V DS = 10V,I D = 6A
22
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 20V, V GS = 0V,
f = 1MHz
f = 1MHz
715
105
60
1.1
955
140
90
pF
pF
pF
?
Switching Characteristics
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate to Source Gate Charge
Gate to Drain “Miller”Charge
V DD = 20V, I D = 1A
V GS = 10V, R GEN = 6 ?
V DS = 20V, I D = 6A,V GS = 5V
9
5
23
3
7.7
2.4
2.8
18
10
37
6
11
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
V SD
Source to Drain Diode Forward Voltage V GS = 0V, I S = 6A (note 2)
0.8
1.2
V
t rr
Q rr
Reverse Recovery Time (note 3)
Reverse Recovery Charge
I F = 6A, d iF /d t = 100A/ μ s
17
7
26
11
ns
nC
Notes:
1: R θ JA is the sum of the junction-to-case and case-to- ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R θ JC is guaranteed by design while R θ JA is determined by the user ’s board design.
a) 81°C/W when
mounted on a 1in 2
pad of 2 oz copper
Scale 1:1 on letter size paper
2: Pulse Test: Pulse Width < 300 us, Duty Cycle < 2.0%.
3: Starting T J = 25 ° C, L = 1mH, I AS = 7.3A, V DD = 40V, V GS = 10V.
b) 135°C/W when mounted on a
minimum pad .
FDS8949 _F085 Rev. A
2
www.fairchildsemi.com
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