参数资料
| 型号： | HIP2100EVAL2 |
| 厂商： | Intersil |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD 48VDC-5UDC CONVERTER |
| 标准包装： | 1 |
| 主要目的： | 电源管理，半 H 桥驱动器（外部 FET） |
| 已用 IC / 零件： | HIP2100 |
| 已供物品： | 板 |
HIP2100
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L16.5x5
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VHHB ISSUE C)
MILLIMETERS
SYMBOL
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
k
L
L1
N
Nd
Ne
P
θ
MIN
0.80
-
-
0.28
2.55
2.55
0.25
0.35
-
4
-
-
NOMINAL
0.90
-
-
0.20 REF
0.33
5.00 BSC
4.75 BSC
2.70
5.00 BSC
4.75 BSC
2.70
0.80 BSC
-
0.60
-
16
4
4
-
-
MAX
1.00
0.05
1.00
0.40
2.85
2.85
-
0.75
0.15
0.60
12
NOTES
-
-
9
9
5, 8
-
9
7, 8
-
9
7, 8
-
-
8
10
2
3
3
9
9
Rev. 2 10/02
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
10
FN4022.14
相关PDF资料 |
PDF描述 |
|---|---|
| HIP2100EVAL | EVAL BOARD MINI HALF BRIDGE |
| HIP4080AEVAL | EVALUATION BOARD HIP4080/4081 |
| HIP4082EVAL | EVAL BOARD FET DRIVER HIP4082 |
| HIP4086EVAL | EVALUATION BOARD GP HIP4086 |
| HIP6004EVAL1 | EVALUATION BOARD HIP6004 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP2100IB | 功能描述:功率驱动器IC 100V H-BRDG DRVR RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| HIP2100IBT | 功能描述:功率驱动器IC TAPE AND REEL RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| HIP2100IBTS2075 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HIP2100IBZ | 功能描述:功率驱动器IC HIP2100IBZVERSION 100V HALF BRDG DRVR RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| HIP2100IBZT | 功能描述:功率驱动器IC VER 100V H-BRDG DRVR RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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