参数资料
型号: IBM25PPC750-DB0M2500
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 250 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 20/42页
文件大小: 496K
代理商: IBM25PPC750-DB0M2500
7/15/99
v 3.2
Datasheet
Page 27
Preliminary Copy
PowerPC 750TM SCM RISC Microprocessor
PowerPC 750 Microprocessor Package Description
The following sections provide the package parameters and the mechanical dimensions for the 750.
Parameters for the 360 CBGA Package
The package parameters are as provided in the following list. The package type is 25x 25 mm, 360-lead
ceramic ball grid array (CBGA).
Package outline
25 x 25 mm
Interconnects
360 (19 x 19 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.65 mm
Maximum module height
3.20 mm
Ball diameter
0.89 mm (35 mil)
Mechanical Dimensions of the 360 CBGA Package
Figure 21 provides the mechanical dimensions and bottom surface nomenclature of the 360 CBGA package.
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