参数资料
型号: IBM25PPC750-DB0M2500
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 250 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 21/42页
文件大小: 496K
代理商: IBM25PPC750-DB0M2500
Page 28
v 3.2
Datasheet
7/15/99
PowerPC 750TM SCM RISC Microprocessor
Preliminary Copy
Figure 21. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA Package.
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
TOP SIDE A1 CORNER INDEX IS A METALIZED
FEATURE WITH VARIOUS SHAPES. BOTTOM SIDE A1
CORNER IS DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
DIM
MIN
MAX
MILLIMETERS
A
2.65
3.20
A1
0.80
1.00
A2
1.10
1.30
b
0.82
0.93
D
25.00 BSC
D1
5.00
16.00
e
1.27 BSC
E
25.00 BSC
E1
5.00
16.00
0.2
D
2X
A01 CORNER
E
E1
D1
0.2
2X
B
A
LOCATOR
e
123456789 10111213141516 171819
U
V
W
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B
C
360X
A
0.3
C
0.15
b
A
A1
A2
C
0.15 C
Not To Scale
(18x)
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