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| 型号： | IBM25PPC750-DB0M2500 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 250 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 33/42页 |
| 文件大小： | 496K |
| 代理商： | IBM25PPC750-DB0M2500 |
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7/15/99
v 3.2
Datasheet
Page 39
Preliminary Copy
PowerPC 750TM SCM RISC Microprocessor
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows
TJ = TA + TR + (θJC + θINT + θSA) * PD
Where:
TJj is the die-junction temperature
TA is the inlet cabinet ambient temperature
TR is the air temperature rise within the system cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the thermal resistance of the thermal interface material
θ
SA is the heat sink-to-ambient thermal resistance
PD is the power dissipated by the device
Typical die-junction temperatures (TJ) should be maintained less than the value specified in Table 3. The
temperature of the air cooling the component greatly depends upon the ambient inlet air temperature and the
air temperature rise within the computer cabinet. An electronic cabinet inlet-air temperature (TA) may range
from 30 to 40
°C. The air temperature rise within a cabinet (T
R) may be in the range of 5 to 10°C. The thermal
resistance of the interface material (
θ
INT) is typically about 1°C/W. Assuming a TA of 30°C, a TRof 5°C, a
CBGA package
θ
JC = 0.03, and a power dissipation (Pd) of 5.0 watts, the following expression for TJ is
obtained:
Die-junction temperature:
TJ = 30°C + 5°C + (0.03°C/W +1.0°C/W + θSA) * 5 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
SA) versus air flow velocity
is shown in Figure 27.
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