参数资料
型号: IDT70V26L35G
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/17页
文件大小: 0K
描述: IC SRAM 256KBIT 35NS 84PGA
标准包装: 3
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 256K(16K x 16)
速度: 35ns
接口: 并联
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 84-BPGA
供应商设备封装: 84-PGA(27.94x27.94)
包装: 托盘
其它名称: 70V26L35G
IDT70V26S/L
High-Speed 16K x 16 Dual-Port Static RAM
Waveform of Read Cycles (5)
ADDR
t RC
Industrial and Commercial Temperature Ranges
t AA
(4)
CE
t ACE (4)
OE
t AOE
(4)
UB , LB
R/ W
t ABE
(4)
VALID DATA
DATA OUT
BUSY OUT
t LZ
(1)
(4)
t OH
(2)
t HZ
t BDD
(3,4)
2945 drw 07
NOTES:
1. Timing depends on which signal is asserted last, OE , CE , LB , or UB .
2. Timing depends on which signal is de-asserted first CE , OE , LB , or UB .
3. t BDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY has no
relation to valid output data.
4. Start of valid data depends on which timing becomes effective last t AOE , t ACE , t AA or t BDD .
5. SEM = V IH .
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage (5)
70V26X25
Com'l
& Ind
70V26X35
Com'l Only
70V26X55
Com'l Only
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
WRITE CYCLE
t WC
Write Cycle Time
25
____
35
____
55
____
ns
t EW
Chip Enable to End-of-Write
(3)
20
____
30
____
45
____
ns
t AW
Address Valid to End-of-Write
20
____
30
____
45
____
ns
t AS
Address Set-up Time
(3)
0
____
0
____
0
____
ns
t WP
t WR
t DW
Write Pulse Width
Write Recovery Time
Data Valid to End-of-Write
20
0
15
____
____
____
25
0
20
____
____
____
40
0
30
____
____
____
ns
ns
ns
t HZ
Output High-Z Time
(1,2)
____
15
____
20
____
25
ns
Write Enable to Output in High-Z
t DH
t WZ
Data Hold Time (4)
(1,2)
0
____
____
15
0
____
____
20
0
____
____
25
ns
ns
t OW
t SWRD
t SPS
Output Active from End-of-Write
SEM Flag Write to Read Time
SEM Flag Contention Window
(1,2,4)
0
5
5
____
____
____
0
5
5
____
____
____
0
5
5
____
____
____
ns
ns
ns
NOTES:
2945 tbl 12
1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. To access RAM, CE = V IL and SEM = V IH . To access semaphore, CE = V IH and SEM = V IL . Either condition must be valid for the entire t EW time.
4. The specification for t DH must be met by the device supplying write data to the RAM under all operating conditions. Although t DH and t OW values will vary over voltage and
temperature, the actual t DH will always be smaller than the actual t OW .
5. 'X' in part numbers indicates power rating (S or L).
8
6.42
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