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参数资料
型号： IDT82V3288
厂商： Integrated Device Technology, Inc.
英文描述： WAN PLL
中文描述： 广域网锁相环
文件页数： 152/170页
文件大小： 1053K
代理商： IDT82V3288
IDT82V3288
WAN PLL
Thermal Management
152
June 22, 2006
8
THERMAL MANAGEMENT
The device operates over the industry temperature range -40°C ~
+85°C. To ensure the functionality and reliability of the device, the maxi-
mum junction temperature T
jmax
should not exceed 125°C. In some
applications, the device will consume more power and a thermal solution
should be provided to ensure the junction temperature T
j
does not
exceed the T
jmax
.
8.1
JUNCTION TEMPERATURE
Junction temperature T
j
is the temperature of package typically at the
geographical center of the chip where the device's electrical circuits are.
It can be calculated as follows:
Equation 1: T
j
= T
A
+ P X
θ
JA
Where:
θ
JA
= Junction-to-Ambient Thermal Resistance of the Package
T
j
= Junction Temperature
T
A
= Ambient Temperature
P = Device Power Consumption
In order to calculate junction temperature, an appropriate
θ
JA
must
be used. The
θ
JA
is shown in
Table 45
:
Power consumption is the core power excluding the power dissipated
in the loads.
Table 44
provides power consumption in special environ-
ments.
8.2
EXAMPLE OF JUNCTION TEMPERATURE
CALCULATION
Assume:
T
A
= 85°C
θ
JA
= 21°C/W (when airfow rate is 5 m/s)
P = 1.8W
The junction temperature T
j
can be calculated as follows:
T
j
= T
A
+ P X
θ
JA
= 85°C + 1.8W X 21°C/W = 122.8°C
The junction temperature of 122.8°C is below the maximum junction
temperature of 125°C so no extra heat enhancement is required.
In some operation environments, the calculated junction temperature
might exceed the maximum junction temperature of 125°C and an exter-
nal thermal solution such as a heatsink is required.
8.3
HEATSINK EVALUATION
A heatsink is expanding the surface area of the device to which it is
attached.
θ
JA
is now a combination of device case and heat-sink thermal
resistance, as the heat flowing from the die junction to ambient goes
through the package and the heatsink.
θ
JA
can be calculated as follows:
Equation 2:
θ
JA
=
θ
JC
+
θ
HA
Where:
θ
JC
= Junction-to-Case (Heatsink) Thermal Resistance
θ
HA
= Heatsink-to-Ambient Thermal Resistance
θ
HA
determines which heatsink can be selected to ensure the junc-
tion temperature does not exceed the maximum junction temperature.
According to Equation 1 and 2, the heatsink-to-ambient thermal resis-
tance
θ
HA
can be calculated as follows:
Equation 3:
θ
HA
= (T
j
- T
A
) / P -
θ
JC
Assume:
T
j
= 125°C (T
jmax
)
T
A
= 85°C
P = 1.8W
θ
JC
= 9°C/W
The heatsink-to-ambient thermal resistance
θ
HA
can be calculated
as follows:
θ
HA
= (125°C - 85°C ) / 1.8W - 9°C/W = 13.2°C/W
That is, if a heatsink whose heatsink-to-ambient thermal resistance
θ
HA
is below or equal to 13.2°C/W is used in such operation environ-
ment, the junction temperature will not exceed the maximum junction
temperature.
Table 44: Power Consumption and Maximum Junction Temperature
Package
Power
Consumption (W)
Operating
Voltage
(V)
T
A
(°C)
Maximum
Junction
Temperature (°C)
CABGA/BC208
2.28
3.6
85
125
Table 45: Thermal Data
Package
Pin Count
Thermal Pad
θ
JC
(°C/W)
θ
JB
(°C/W)
θ
JA
(°C/W) Air Flow in m/s
0
1
2
3
4
5
CABGA/BC208
208
No
9
9.9
29.6
25.3
23.4
22.3
21.6
21
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