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| 型号： | IMSH2GU13A1F1C-08D |
| 厂商： | QIMONDA AG |
| 元件分类： | DRAM |
| 英文描述： | 256M X 64 DDR DRAM MODULE, DMA240 |
| 封装： | GREEN, UDIMM-240 |
| 文件页数： | 45/49页 |
| 文件大小： | 986K |
| 代理商： | IMSH2GU13A1F1C-08D |
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IMSH[1G/2G][U/E]x3A1F1C(T)
DDR3 Unbuffered DIMM
Advance Internet Data Sheet
Rev. 0.63, 2008-08
5
03052008-R2G5-2FN2
1.2
Description
Qimonda IMSH[1G/2G][U/E]x3A1F1C(T) are Unbuffered
DIMM family with 30 mm height based on DDR3 SDRAM
technology. DIMMs are available non-ECC modules
in
128M
× 64 (1GB), 256M × 64 (2GB), and as ECC modules in
128M
× 72 (1GB),
256M
× 72 (2GB)
organization
and
density, intended for mounting into 240 pin connector
sockets.
The memory array is designed with 1Gb Double Data Rate
(DDR3) Synchronous DRAMs. De-coupling capacitors, stub
resistors, calibration resistors and termination resistors are
mounted on the PCB board. The DIMMs feature serial
presence detect based on a 256 byte serial EEPROM device
using the 2-pin I
2C protocol. The first 176 bytes are
programmed with module specific SPD data.
TABLE 3
Ordering Information Table for Modules without Thermal Sensor
QAG Part Number
Compliance Code
Description
1024 MByte Non-ECC Unbuffered DIMM IMSH1GU03A1F1C
IMSH1GU03A1F1C-08D 1GB 1R×8 PC3–6400U–5-10–A0
240-pin 1024 MByte DDR3 Unbuffered DIMM with one
rank for non-ECC applications. The memory rank consists
of eight DDR3 components in x8 organization. Standard
reference card A is used on this assembly
Used DDR3 SDRAM Component
Part Number: IDSH1G-03A1F1C
Density: 1Gbit
Organization: 128Mbit × 8
Address Bits (Row/Column/Bank): 14/10/3
IMSH1GU03A1F1C-08E 1GB 1R×8 PC3–6400U–6-10–A0
IMSH1GU03A1F1C-10F 1GB 1R×8 PC3–8500U–7-10–A0
IMSH1GU03A1F1C-10G 1GB 1R×8 PC3–8500U–8-10–A0
IMSH1GU03A1F1C-13G 1GB 1R×8 PC3–10600U–8-10–A0
IMSH1GU03A1F1C-13H 1GB 1R×8 PC3–10600U–9-10–A0
IMSH1GU03A1F1C-16J
1GB 1R×8 PC3–12800U-10-10–A0
2048 MByte Non-ECC Unbuffered DIMM IMSH2GU13A1F1C
IMSH2GU13A1F1C-08D 2GB 2R×8 PC3–6400U–5-10–B0
240-pin 2048 MByte DDR3 Unbuffered DIMM with two
ranks for non-ECC applications. Each memory rank
consists of eight DDR3 components in x8 organization.
Standard reference card B is used on this assembly
Used DDR3 SDRAM Component
Part Number: IDSH1G-03A1F1C
Density: 1Gbit
Organization: 128Mbit × 8
Address Bits (Row/Column/Bank): 14/10/3
IMSH2GU13A1F1C-08E 2GB 2R×8 PC3–6400U–6-10–B0
IMSH2GU13A1F1C-10F 2GB 2R×8 PC3–8500U–7-10–B0
IMSH2GU13A1F1C-10G 2GB 2R×8 PC3–8500U–8-10–B0
IMSH2GU13A1F1C-13G 2GB 2R×8 PC3–10600U–8-10–B0
IMSH2GU13A1F1C-13H 2GB 2R×8 PC3–10600U–9-10–B0
IMSH2GU13A1F1C-16J
2GB 2R×8 PC3–12800U–10-10–B0
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