参数资料
| 型号： | ISL6277IRZ |
| 厂商： | Intersil |
| 文件页数： | 33/37页 |
| 文件大小： | 0K |
| 描述： | IC PWM REG MULTIPH AMD 48-QFN |
| 标准包装： | 50 |
| 应用： | 控制器，AMD Fusion? SVI 2.0 CPU GPU |
| 输入电压： | 4.5 V ~ 25 V |
| 输出数： | 2 |
| 输出电压： | 0.006 V ~ 1.55 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-VFQFN 裸露焊盘 |
| 供应商设备封装： | 48-QFN（6x6） |
| 包装： | 管件 |
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ISL6277
power train. Symmetrical layout allows heat to be dissipated
equally across all power trains. Keeping the distance between
the power train and the control IC short helps keep the gate drive
traces short. These drive signals include the LGATE, UGATE,
PGND, PHASE and BOOT.
When placing MOSFETs, try to keep the source of the upper
MOSFETs and the drain of the lower MOSFETs as close as
thermally possible (see Figure 33). Input high-frequency
capacitors should be placed close to the drain of the upper
MOSFETs and the source of the lower MOSFETs. Place the output
inductor and output capacitors between the MOSFETs and the
VIAS TO
GROUND
PLANE
INDUCTOR
HIGH-SIDE
MOSFETS
GND
VOUT
PHASE
NODE
VIN
OUTPUT
CAPACITORS
SCHOTTKY
DIODE
LOW-SIDE
MOSFETS
INPUT
CAPACITORS
load. High-frequency output decoupling capacitors (ceramic)
should be placed as close as possible to the decoupling target
(microprocessor), making use of the shortest connection paths to
any internal planes. Place the components in such a way that the
area under the IC has less noise traces with high dV/dt and di/dt,
such as gate signals and phase node signals.
Table 14 shows layout considerations for the ISL6277 controller
by pin.
FIGURE 33. TYPICAL POWER COMPONENT PLACEMENT
TABLE 14. LAYOUT CONSIDERATIONS FOR THE ISL6277 CONTROLLER
ISL6277 PIN
BOTTOM PAD
1
2
3
4
5
6
7
8
9
10
11
12
SYMBOL
GND
ISEN2_NB
NTC_NB
IMON_NB
SVC
VR_HOT_L
SVD
VDDIO
SVT
ENABLE
PWROK
IMON
NTC
33
LAYOUT GUIDELINES
Connect this ground pad to the ground plane through a low impedance path. A minimum of 5 vias are
recommended to connect this pad to the internal ground plane layers of the PCB
Each ISEN pin has a capacitor (Cisen) decoupling it to VSUMN_NB, then through another capacitor (Cvsumn_nb)
to GND. Place Cisen capacitors as close as possible to the controller and keep the following loops small:
1. ISEN1_NB pin to ISEN2_NB pin
2. Any ISENx_NB pin to GND
The NTC thermistor must be placed close to the thermal source that is monitored to determine Northbridge
thermal throttling. Placement at the hottest spot of the Northbridge VR is recommended. Additional standard
resistors in the resistor network on this pin should be placed near the IC.
Place the IMON_NB resistor close to this pin and make keep a tight GND connection.
Use good signal integrity practices and follow AMD recommendations.
Follow AMD recommendations. Placement of the pull-up resistor near the IC is recommended.
Use good signal integrity practices and follow AMD recommendations.
Use good signal integrity practices and follow AMD recommendations.
Use good signal integrity practices and follow AMD recommendations.
No special considerations.
Use good signal integrity practices and follow AMD recommendations.
Place the IMON resistor close to this pin and make keep a tight GND connection.
The NTC thermistor must be placed close to the thermal source that is monitored to determine Core thermal
throttling. Placement at the hottest spot of the Core VR is recommended. Additional standard resistors in the
resistor network on this pin should be placed near the IC.
FN8270.1
March 8, 2012
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| ISL6277IRZ-T | 功能描述:IC PWM REG MULTIPH AMD 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 标准包装:43 系列:- 应用:控制器，Intel VR11 输入电压:5 V ~ 12 V 输出数:1 输出电压:0.5 V ~ 1.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-VFQFN 裸露焊盘 供应商设备封装:48-QFN（7x7） 包装:管件 |
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