参数资料
| 型号： | ISL6545IBZ-T |
| 厂商： | Intersil |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 8-SOIC |
| 标准包装： | 1 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 330kHz |
| 占空比： | 100% |
| 电源电压： | 4.5 V ~ 14.4 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 包装： | 标准包装 |
| 产品目录页面： | 1243 (CN2011-ZH PDF) |
| 其它名称： | ISL6545IBZ-TDKR |
ISL6545, ISL6545A
sense resistor), the regular boot refresh circuit will still be
active.
Current Sinking
The ISL6545x incorporates a MOSFET shoot-through
protection method which allows a converter to sink current
capacitors C IN and C O may each represent numerous physical
capacitors. For best results, locate the ISL6545x within 1 inch
of the MOSFETs, Q 1 and Q 2 . The circuit traces for the
MOSFET gate and source connections from the ISL6545x
must be sized to handle up to 1A peak current.
as well as source current. Care should be exercised when
designing a converter with the ISL6545x when it is known
that the converter may sink current.
When the converter is sinking current, it is behaving as a
ISL6545,
BOOT
C BOOT
PHASE
+V IN
Q 1
L O
V OUT
boost converter that is regulating its input voltage. This
means that the converter is boosting current into the V CC
ISL6545A
LGATE/OCSET
VCC
+V CC
Q 2
C O
rail, which supplies the bias voltage to the ISL6545x. If there
is nowhere for this current to go, such as to other distributed
loads on the V CC rail, through a voltage limiting protection
device, or other methods, the capacitance on the V CC bus
will absorb the current. This situation will allow voltage level
of the V CC rail to increase. If the voltage level of the rail is
boosted to a level that exceeds the maximum voltage rating
of the ISL6545x, then the IC will experience an irreversible
failure and the converter will no longer be operational.
Ensuring that there is a path for the current to follow other
than the capacitance on the rail will prevent this failure
mode.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible, using ground
plane construction or single point grounding.
V IN
ISL6545,
ISL6545A
C VCC
GND
FIGURE 8. PRINTED CIRCUIT BOARD SMALL SIGNAL
LAYOUT GUIDELINES
Figure 8 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
current paths on the COMP/SD pin and locate the resistor,
R OSCET close to the COMP/SD pin because the internal
current source is only 20μA. Provide local V CC decoupling
between V CC and GND pins. Locate the capacitor, C BOOT
as close as practical to the BOOT and PHASE pins. All
components used for feedback compensation (not shown)
should be located as close to the IC as practical.
Feedback Compensation
This section highlights the design consideration for a
voltage-mode controller requiring external compensation. To
address a broad range of applications, a type-3 feedback
network is recommended, as shown in the top part of
Figure 9.
Figure 9 also highlights the voltage-mode control loop for a
synchronous-rectified buck converter, applicable to the
ISL6545x circuit. The output voltage (V OUT ) is regulated to the
UGATE
PHASE
Q 1
L O
V OUT
reference voltage, V REF . The error amplifier output (COMP pin
voltage) is compared with the oscillator (OSC) modified
sawtooth wave to provide a pulse-width modulated wave with
LGATE/OCSET
Q 2
C IN
C O
an amplitude of V IN at the PHASE node. The PWM wave is
smoothed by the output filter (L and C). The output filter
capacitor bank’s equivalent series resistance is represented by
the series resistor E.
RETURN
FIGURE 7. PRINTED CIRCUIT BOARD POWER AND
GROUND PLANES OR ISLANDS
Figure 7 shows the critical power components of the converter.
To minimize the voltage overshoot, the interconnecting wires
indicated by heavy lines should be part of a ground or power
plane in a printed circuit board. The components shown should
be located as close together as possible. Please note that the
10
FN6305.6
March 3, 2011
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| ISL6545IRZ | 功能描述:IC REG CTRLR BUCK PWM VM 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| ISL6545IRZ-T | 功能描述:IC REG CTRLR BUCK PWM VM 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
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