参数资料
型号: LFX125EB-05F256C
厂商: Lattice Semiconductor Corporation
文件页数: 37/119页
文件大小: 0K
描述: IC FPGA 139K GATES 256-BGA
标准包装: 90
系列: ispXPGA®
逻辑元件/单元数: 1936
RAM 位总计: 94208
输入/输出数: 160
门数: 139000
电源电压: 2.3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-BGA
供应商设备封装: 256-FPBGA(17x17)
Lattice Semiconductor
ispXPGA Family Data Sheet
20
pattern by a device programmer, securing proprietary designs from competitors. The entire device must be erased
in order to erase the security scheme.
Density Shifting
The ispXPGA family has been designed to ensure that different density devices in the same package have the
same pin-out. Furthermore, the architecture ensures a high success rate when performing design migration from
lower density parts to higher density parts. In many cases, it is possible to shift a lower utilization design targeted
for a high-density device to a lower density device. However, the exact details of the final resource utilization will
impact the likely success in each case.
Temperature Sensing Diode
The built-in temperature-sensing diodes allow junction temperature to be measured during device operation. A pair
of pins (DXp and DXn) are dedicated for monitoring device junction temperature. The measurement is done by
forcing 10 A and 100 A current in the forward direction, and then measuring the resulting voltage. The voltage
decreases with increasing temperature at approximately 1.64 mV/°C. A typical device with a 85°C junction temper-
ature will measure approximately 593 mV.
The temperature-sensing diode works for the entire operating range as shown in Figure 22 - Sensing Diode Volt-
age-Temperature Relationship. Refer to the Lattice Thermal Management document for thermal coefficients. Also
Figure 22. Sensing Diode Voltage-Temperature Relationship
Voltage
Junction Temperature (
°C)
0.50
0.60
0.70
0.80
-50
0
50
100
125
-25
25
75
0.85
0.65
0.75
0.55
100 uA
10 uA
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LFX125EB-05F516C 功能描述:FPGA - 现场可编程门阵列 139K 176 I/O ispJTAG RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFX125EB-05FH516C 功能描述:FPGA - 现场可编程门阵列 Use LFX125EB-05F516C RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFX125EB-05FN256C 功能描述:FPGA - 现场可编程门阵列 E-Ser139K Gt ispJTAG 2.5/3.3V -5 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFX125EB-05FN516C 功能描述:FPGA - 现场可编程门阵列 E-Ser139K Gt ispJTA G 2.5/3.3V -5 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFX125EB-3F256C 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:ispXPGA Family