参数资料
型号: MAX17409GTI+T
厂商: Maxim Integrated Products
文件页数: 12/32页
文件大小: 0K
描述: IC CTRLR NVIDIA CPU 28-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
系列: Quick-PWM™
应用: 处理器
电流 - 电源: 1.5mA
电源电压: 4.5 V ~ 5.5 V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 28-WFQFN 裸露焊盘
供应商设备封装: 28-TQFN-EP(4x4)
包装: 带卷 (TR)
1-Phase Quick-PWM GPU Controller
Pin Description (continued)
PIN
22
23
24
25
26
27
28
NAME
DH
GND
VRHOT
REF
ILIM
V CC
CCV
EP
FUNCTION
High-Side Gate-Driver Output. DH swings from LX to BST. The controller pulls DH low in shutdown.
Analog Ground. Internally connected to GND.
Thermal Comparator’s Open-Drain Output. The comparator pulls VRHOT low when the voltage at
THRM drops below 30% of V CC (1.5V with 5V V CC ). VRHOT is high impedance in shutdown.
Buffered 2V Reference Output. Bypass REF with a 100pF to 1000pF capacitor. Do not exceed 1000pF.
Valley Current-Limit Adjustment Input. The valley current-limit threshold voltage at CSP to CSN
equals precisely 1/10 of the differential REF to ILIM voltage over a 0.1V to 0.5V range (10mV to 50mV
current-sense range). The negative current-limit threshold is nominally -125% of the corresponding
valley current-limit threshold.
Connect ILIM directly to V CC to set the default 22.5mV current-limit threshold setting.
Analog Supply Voltage. Connect to a 4.5V to 5.5V source. Bypass to GND with a 1μF minimum capacitor.
Integrator Capacitor Connection. Connect a capacitor (C CCV ) from CCV to GND to set the integration
time constant. Choose the capacitor value according to:
16 x [C CCV /G m(CCV) ] x f SW >> 1
where G m(CCV) = 320 S (max) is the integrator’s transconductance and f SW is the switching
frequency set by the R TON resistance.
The integrator is internally disabled during any downward output-voltage transition that occurs in
pulse-skipping mode, and remains disabled until the transition blanking period expires and the
output reaches regulation (error-amplifier transition detected).
Exposed Pad (Backside). Internally connected to the substrate. Connect to the ground plane through
a thermally enhanced via.
12
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