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| 型号： | MAX17409GTI+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/32页 |
| 文件大小： | 0K |
| 描述： | IC CTRLR NVIDIA CPU 28-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 系列： | Quick-PWM™ |
| 应用： | 处理器 |
| 电流 - 电源： | 1.5mA |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 供应商设备封装： | 28-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
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1-Phase Quick-PWM GPU Controller
ABSOLUTE MAXIMUM RATINGS
V CC , V DD to GND .....................................................-0.3V to +6V
G0–G5 to GND .........................................................-0.3V to +6V
CSP, CSN to GND ....................................................-0.3V to +6V
ILIM, THRM, VRHOT , PWRGD to GND ....................-0.3V to +6V
SKIP to GND.............................................................-0.3V to +6V
CCV, FB, IMON, REF to GND .....................-0.3V to (V CC + 0.3V)
SHDN to GND (Note 1)...........................................-0.3V to +30V
TON to GND ...........................................................-0.3V to +30V
GNDS/OFSP, PGND to GND (Note 2) ...................-0.3V to +0.3V
Internal Driver (Note 2)
DL to PGND .............................................-0.3V to (V DD + 0.3V)
BST to GND .........................................................-0.3V to +36V
Note 1: SHDN might be forced to 12V for the purpose of debugging
LX to BST...............................................................-6V to +0.3V
BST to V DD ..........................................................-0.3V to +30V
DH to LX .................................................-0.3V to (V BST + 0.3V)
Continuous Power Dissipation (T A = +70°C)
28-Pin 4mm x 4mm TQFN
(derate 21.3mW/°C above +70°C) ............................1702mW
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10s) .................................+300°C
prototype breadboards using the no-fault test mode, which dis-
ables fault protection.
Note 2: Measurements valid using a 20MHz bandwidth limit.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, V IN = 12V, V DD = V CC = 5V, SHDN = ILIM = V CC , SKIP = GNDS = PGND = GND, V FB = V CSP = V CSN = 1.05V;
G5–G0 set for 1.05V (G0–G5 = 100110); T A = 0 ° C to +85 ° C , unless otherwise specified. Typical values are at T A = +25°C.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
PWM CONTROLLER
Input Voltage Range
DC Output-Voltage Accuracy
V CC , V DD
Measured at FB with respect to GNDS;
includes load-regulation error (Note 4)
4.5
-6
5.5
+6
V
mV
Line Regulation Error
GNDS Input Range
V CC = 4.5V to 5.5V, V IN = 4.5V to 26V
-200
0.1
+200
%
mV
GNDS/OFSP Gain
A GNDS
V OUT / V GNDS , -200mV
V GNDS
+200mV
0.97
1.00
1.03
V/V
GNDS/OFSP Input Bias Current
I GNDS
-2
+2
μA
REF Voltage
Dynamic VID Slew-Rate Accuracy
Soft-Start/Soft-Shutdown
Slew-Rate Accuracy
V REF
V CC = 4.5V to 5.5V, I REF = 100μA
I REF = 0 to 1mA
1.98
1.97
11.0
1.248
2.000
2.000
12.5
1.56
2.02
2.02
14.0
1.872
V
mV/μs
mV/μs
R TON = 96.75k
142
167
192
On-Time (Note 5)
t ON
V IN = 12V, V FB = 1.2V
R TON = 200k
300
333
366
ns
R TON = 303.25k
425
500
575
Minimum Off-Time
TON Shutdown Input Current
t OFF(MIN)
Measured at DH (Note 5)
SHDN = GND, V IN = 26V, V CC = V DD = 0 or 5V
300
0.01
375
0.1
ns
μA
2
_______________________________________________________________________________________
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