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| 型号： | MC7455ARX867LG |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA483 |
| 封装： | 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件页数： | 47/76页 |
| 文件大小： | 1520K |
| 代理商： | MC7455ARX867LG |
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MOTOROLA
MPC7455 RISC Microprocessor Hardware Specifications
51
System Design Information
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, GVDD, and OVDD planes, to enable quick recharging of the smaller chip capacitors. These
bulk capacitors should have a low equivalent series resistance (ESR) rating to ensure the quick response
time necessary. They should also be connected to the power and ground planes through two vias to minimize
inductance. Suggested bulk capacitors: 100–330 F (AVX TPS tantalum or Sanyo OSCON).
1.9.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD. Unused active high inputs should be connected to
GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, OVDD, GVDD, and GND pins in the
MPC7455. If the L3 interface is not used, GVDD should be connected to the OVDD power plane, and
L3VSEL should be connected to BVSEL.
1.9.5
Output Buffer DC Impedance
The MPC7455 processor bus and L3 I/O drivers are characterized over process, voltage, and temperature.
To measure Z0, an external resistor is connected from the chip pad to OVDD or GND. Then, the value of
each resistor is varied until the pad voltage is OVDD/2 (see Figure 23).
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals OVDD/2. RN then becomes the resistance of the pull-down devices. When data is held high, SW1
is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals OVDD/2. RP then becomes
the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 =
(RP + RN)/2.
Figure 25. Driver Impedance Measurement
Table 19 summarizes the signal impedance results. The impedance increases with junction temperature and
is relatively unaffected by bus voltage.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC7455ARX933LF | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7455ARX933LG | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7457RX1000LC | 功能描述:微处理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7457RX1000NB | 制造商:Motorola Inc 功能描述: |
| MC7457RX1000NC | 功能描述:微处理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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