- 您现在的位置：买卖IC网 > PDF目录67968 > MC7455ARX867LG (MOTOROLA INC) 32-BIT, 867 MHz, RISC PROCESSOR, CBGA483 PDF资料下载
参数资料
| 型号： | MC7455ARX867LG |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA483 |
| 封装： | 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件页数： | 52/76页 |
| 文件大小： | 1520K |
| 代理商： | MC7455ARX867LG |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页当前第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页
56
MPC7455 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
1.9.8.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 27 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相关PDF资料 |
PDF描述 |
|---|---|
| MC7445ARX733LG | 32-BIT, 733 MHz, RISC PROCESSOR, CBGA360 |
| MC7445ARX1000LG | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360 |
| MC7445ARX933LG | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA360 |
| MC7455ARX1000LG | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA483 |
| MC7455ARX933LG | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA483 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC7455ARX933LF | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7455ARX933LG | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7457RX1000LC | 功能描述:微处理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7457RX1000NB | 制造商:Motorola Inc 功能描述: |
| MC7457RX1000NC | 功能描述:微处理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。