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参数资料
| 型号： | MC7455ARX867LG |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA483 |
| 封装： | 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件页数： | 55/76页 |
| 文件大小： | 1520K |
| 代理商： | MC7455ARX867LG |
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MOTOROLA
MPC7455 RISC Microprocessor Hardware Specifications
59
System Design Information
affect the final operating die-junction temperature—airflow, board population (local heat flux of adjacent
components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as system-level designs.
For system thermal modeling, the MPC7445 and MPC7455 thermal model is shown in Figure 28. Four
volumes will be used to represent this device. Two of the volumes, solder ball, and air and substrate, are
modeled using the package outline size of the package. The other two, die, and bump and underfill, have the
same size as the die. Dimensions for these volumes for the MPC7445 and MPC7455 are given in Figure 20
and Figure 21, respectively. The silicon die should be modeled 9.10
× 12.25 × 0.74 mm with the heat source
applied as a uniform source at the bottom of the volume. The bump and underfill layer is modeled as 9.10
×
12.25
× 0.069 mm (or as a collapsed volume) with orthotropic material properties: 0.6 W/(m K) in the
xy-plane and 2 W/(m K) in the direction of the z-axis. The substrate volume is 25
× 25 × 1.2 mm
(MPC7445) or 29
× 29 × 1.2 mm (MPC7455), and this volume has 18 W/(m K) isotropic conductivity.
The solder ball and air layer is modeled with the same horizontal dimensions as the substrate and is 0.9 mm
thick. It can also be modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m K)
in the xy-plane direction and 3.8 W/(m K) in the direction of the z-axis.
Figure 30. Recommended Thermal Model of MPC7445 and MPC7455
Bump and Underfill
Die
Substrate
Solder and Air
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Bump and Underfill
kx
0.6
W/(m K)
ky
0.6
kz
2
Substrate
k18
Solder Ball and Air
kx
0.034
ky
0.034
kz
3.8
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC7455ARX933LF | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7455ARX933LG | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7457RX1000LC | 功能描述:微处理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7457RX1000NB | 制造商:Motorola Inc 功能描述: |
| MC7457RX1000NC | 功能描述:微处理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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