参数资料
型号: MCZ33781EK
厂商: Freescale Semiconductor
文件页数: 40/44页
文件大小: 0K
描述: IC MASTER DSI 2.02 DIFF 32-SOIC
标准包装: 42
应用: 车载系统
接口: SPI
电源电压: 4.75 V ~ 5.25 V
封装/外壳: 32-BSOP(0.295",7.50mm 宽)裸露焊盘
供应商设备封装: 32-SOICW 裸露焊盘
包装: 管件
安装类型: 表面贴装
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33781
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to GND unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltages
VSUPn
Load Dump VSUPn (300ms maximum - either pin)
VCC
VDD
VPP
VSUP1 and
VSUP2
VSUPLD
VCC
VDD
VPP
-0.3 to 26.5
40
-0.3 to 7.0
-0.3 to 3.1
-0.3 to 10.0
V
Maximum Voltage on Logic Input/Output Pins
-0.3 to VCC +0.3
V
Maximum Voltage on DBUS Pins
VDBUS
-0.3 to VSUPn + 0.3
V
Maximum DBUS Pin Current
IDBUS
400
mA
Maximum Logic Pin Current
ILOGIC
20
mA
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
Corner pins
All other pins
VESD
±2000
±200
±750
±500
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 90
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Shutdown (Bus Drivers and Pseudo Bus Switch)
TSD
155 to 190
°C
Resistance, Junction-to-Ambient
RθJA
71
°C/W
Resistance, Junction-to-Board
RθJB
6
°C/W
Soldering Reflow Temperature
TSOLDER
260
°C
Peak Package Reflow Temperature During Reflow(2),(3)
TPPRT
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω); ESD2 testing is performed
in accordance with the Machine Model (MM) (CZAP = 200pF, RZAP = 0Ω); and Charge Body Model (CBM).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3.
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