参数资料
型号: MPC5561MVZ80R
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: MICROCONTROLLER, PBGA324
封装: 23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, LEAD FREE, TEPBGA-324
文件页数: 1/56页
文件大小: 1044K
代理商: MPC5561MVZ80R
Freescale Semiconductor
Data Sheet: Technical Data
Contents
Freescale Semiconductor, Inc., 2008. All rights reserved.
Document Number: MPC5561
Rev. 2.0, 27 May 2008
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5561
microcontroller device. For functional characteristics,
refer to the MPC5561 Microcontroller Reference
Manual.
1
Overview
The MPC5561 microcontroller (MCU) is a member of
the MPC5500 family of microcontrollers built on the
Power Architecture embedded technology. This
family of parts has many new features coupled with high
performance CMOS technology to provide substantial
reduction of cost per feature and significant performance
improvement over the MPC500 family.
The host processor core of this device complies with the
Power Architecture embedded category that is 100%
user-mode compatible (including floating point library)
with the original Power PC user instruction set
architecture (UISA). The embedded architecture
enhancements improve the performance in embedded
applications. The core also has additional instructions,
including digital signal processing (DSP) instructions,
beyond the original Power PC instruction set.
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2
Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 5
3.3
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4
EMI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5
ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9
3.6
VRC and POR Electrical Specifications . . . . . . . . . 9
3.7
Power-Up/Down Sequencing . . . . . . . . . . . . . . . . 10
3.8
DC Electrical Specifications. . . . . . . . . . . . . . . . . . 13
3.9
Oscillator and FMPLL Electrical
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22
3.11 H7Fa Flash Memory Electrical
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.1
MPC5561 324 PBGA Pinout . . . . . . . . . . . . . . . . 44
4.2
MPC5561 324-Pin Package Dimensions . . . . . . . 45
5
Revision History for the MPC5561 Data Sheet . . . . . . 47
5.1
Information Changed Between Revisions
0.1 and 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.2
Information Changed Between Revisions
1.0 and 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
MPC5561
Microcontroller Data Sheet
by: Microcontroller Division
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