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| 型号： | MPC8313E-RDBB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 67/99页 |
| 文件大小： | 0K |
| 描述： | BOARD CPU 8313E VER 2.1 |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MPU |
| 适用于相关产品： | MPC8313E |
| 所含物品： | 板 |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
7
2.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1
Absolute Maximum Ratings
This table provides the absolute maximum ratings.
2.1.2
Power Supply Voltage Specification
This table provides the recommended operating conditions for the MPC8313E. Note that the values in this
table are the recommended and tested operating conditions. If a particular block is given a voltage falling
within the range in the Recommended Value column, the MPC8313E is capable of delivering the amount
of current listed in the Current Requirement column; this is the maximum current possible. Proper device
operation outside of these conditions is not guaranteed.
Table 1. Absolute Maximum Ratings1
Characteristic
Symbol
Max Value
Unit
Note
Core supply voltage
VDD
–0.3 to 1.26
V
—
PLL supply voltage
AVDD
–0.3 to 1.26
V
—
Core power supply for SerDes transceivers
XCOREVDD
–0.3 to 1.26
V
—
Pad power supply for SerDes transceivers
XPADVDD
–0.3 to 1.26
V
—
DDR and DDR2 DRAM I/O voltage
GVDD
–0.3 to 2.75
–0.3 to 1.98
V—
PCI, local bus, DUART, system control and power management, I2C,
and JTAG I/O voltage
NVDD/LVDD
–0.3 to 3.6
V
—
eTSEC, USB
LVDDA/LVDDB
–0.3 to 3.6
V
—
Input voltage
DDR DRAM signals
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
DDR DRAM reference
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Enhanced three-speed Ethernet signals
LVIN
–0.3 to (LVDDA + 0.3)
or
–0.3 to (LVDDB + 0.3)
V4, 5
Local bus, DUART, SYS_CLK_IN, system control,
and power management, I2C, and JTAG signals
NVIN
–0.3 to (NVDD + 0.3)
V
3, 5
PCI
NVIN
–0.3 to (NVDD + 0.3)
V
6
Storage temperature range
TSTG
–55 to 150
C—
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3. Caution: NVIN must not exceed NVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4. Caution: LVIN must not exceed LVDDA/LVDDB by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8313E-RDBB | 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE |
| MPC8313E-RDBC | 功能描述:开发板和工具包 - 其他处理器 8313E CPU board Ver 2.2 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8313EVRADD | 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 90NM 333MHZ 1V/1.8V/2.5V/3.3V 516-PIN TE - Trays |
| MPC8313EVRADDB | 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8313EVRADDC | 功能描述:微处理器 - MPU 8313 REV2.2 W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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