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| 型号： | MPC8313E-RDBB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 86/99页 |
| 文件大小： | 0K |
| 描述： | BOARD CPU 8313E VER 2.1 |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MPU |
| 适用于相关产品： | MPC8313E |
| 所含物品： | 板 |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
87
21.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
21.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
TJ = TC + (RJC x PD)
where:
TJ = junction temperature (C)
TC = case temperature of the package
RJC = junction-to-case thermal resistance
PD = power dissipation
22 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8313E SYS_CLK_IN
22.1
System Clocking
The MPC8313E includes three PLLs.
1. The platform PLL (AVDD2) generates the platform clock from the externally supplied
SYS_CLK_IN input in PCI host mode or SYS_CLK_IN/PCI_SYNC_IN in PCI agent mode. The
frequency ratio between the platform and SYS_CLK_IN is selected using the platform PLL ratio
configuration bits as described in Section 20.1, “System PLL Configuration.”
2. The e300 core PLL (AVDD1) generates the core clock as a slave to the platform clock. The
frequency ratio between the e300 core clock and the platform clock is selected using the e300
PLL ratio configuration bits as described in Section 20.2, “Core PLL Configuration.”
3. There is a PLL for the SerDes block.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8313E-RDBB | 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE |
| MPC8313E-RDBC | 功能描述:开发板和工具包 - 其他处理器 8313E CPU board Ver 2.2 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8313EVRADD | 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 90NM 333MHZ 1V/1.8V/2.5V/3.3V 516-PIN TE - Trays |
| MPC8313EVRADDB | 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8313EVRADDC | 功能描述:微处理器 - MPU 8313 REV2.2 W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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