参数资料
型号: MPC8313E-RDBB
厂商: Freescale Semiconductor
文件页数: 90/99页
文件大小: 0K
描述: BOARD CPU 8313E VER 2.1
标准包装: 1
系列: PowerQUICC II™ PRO
类型: MPU
适用于相关产品: MPC8313E
所含物品:
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
90
Freescale Semiconductor
Third, between the device and any SerDes voltage regulator there should be a 10-F, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-F, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
22.5
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to NVDD, GVDD, LVDD, LVDDA, or LVDDB as required.
Unused active high inputs should be connected to VSS. All NC (no-connect) signals must remain
unconnected.
Power and ground connections must be made to all external VDD, NVDD, GVDD, LVDD, LVDDA, LVDDB,
and VSS pins of the device.
22.6
Output Buffer DC Impedance
The MPC8313E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD
or VSS. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (see Figure 60). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals
NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
Figure 60. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two
measurements. First, the output voltage is measured while driving logic 1 without an external differential
termination resistor. The measured voltage is V1 = Rsource Isource. Second, the output voltage is measured
while driving logic 1 with an external precision differential termination resistor of value Rterm. The
measured voltage is V2 =(1/(1/R1 +1/R2)) Isource. Solving for the output impedance gives Rsource =
Rterm (V1/V2 – 1). The drive current is then Isource =V1/Rsource.
NVDD
VSS
Pad
Data
SW1
SW2
RN
RP
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MPC8313E-RDBB 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE
MPC8313E-RDBC 功能描述:开发板和工具包 - 其他处理器 8313E CPU board Ver 2.2 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC8313EVRADD 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 90NM 333MHZ 1V/1.8V/2.5V/3.3V 516-PIN TE - Trays
MPC8313EVRADDB 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8313EVRADDC 功能描述:微处理器 - MPU 8313 REV2.2 W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324