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参数资料
型号： MPC8541ECPXAKF
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
封装： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件页数： 71/88页
文件大小： 1221K
代理商： MPC8541ECPXAKF
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 3.2
Freescale Semiconductor
73
Thermal
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4
Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the adhesive or interface material thermal resistance
θ
SA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device. See Table 4 and Table 5.
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30
° to 40°C. The air temperature rise within a cabinet (T
R) may be in the range of 5° to
10
°C. The thermal resistance of some thermal interface material (θ
INT) may be about 1°C/W. For the
purposes of this example, the
θ
JC value given in Table 49 that includes the thermal grease interface and is
documented in note 4 is used. If a thermal pad is used,
θ
INT must be added.
Assuming a TI of 30C, a TR of 5C, a FC-PBGA package θJC = 0.96, and a power consumption (PD) of
8.0 W, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.96°C/W + θSA) × 8.0 W
The heat sink-to-ambient thermal resistance (
θ
SA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 45.
Assuming an air velocity of 2 m/s, we have an effective
θ
SA+ of about 3.3C/W, thus
TJ = 30C + 5C + (0.96C/W + 3.3C/W) × 8.0 W,
resulting in a die-junction temperature of approximately 69C which is well within the maximum
operating temperature of the component.
相关PDF资料
PDF描述
MPC8541EPXAKE 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
MPC8541EVTALD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8343VRADDX 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8540VT833JB 32-BIT, 667 MHz, MICROPROCESSOR, PBGA783
MPC8572ECVTARND 32-BIT, 1067 MHz, MICROPROCESSOR, PBGA1023
相关代理商/技术参数
参数描述
MPC8541ECPXALF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8541ECVTAJD 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8541ECVTAJD 制造商:Freescale Semiconductor 功能描述:Microprocessor
MPC8541ECVTALF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8541EPXAJD 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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