参数资料
型号: MSC8126TVT6400
厂商: Freescale Semiconductor
文件页数: 15/48页
文件大小: 0K
描述: IC DSP QUAD 16B 400MHZ 431FCPBGA
标准包装: 60
系列: StarCore
类型: SC140 内核
接口: DSI,以太网,RS-232
时钟速率: 400MHz
非易失内存: 外部
芯片上RAM: 1.436MB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.20V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 431-BFBGA,FCBGA
供应商设备封装: 431-FCPBGA(20x20)
包装: 托盘
配用: MSC8126ADSE-ND - KIT ADVANCED DEV SYSTEM 8126
Electrical Characteristics
This section describes the DC electrical characteristics for the MSC8126. The measurements in Table 5 assume the
following system conditions:
?
?
T A = 25 °C
V DD =
— 400 MHz = 1.14–1.26 V DC
— 500 MHz = 1.16–1.24 V DC
?
V DDH
= 3.3 V ± 5% V DC
?
GND = 0 V DC
Note: The leakage current is measured for nominal V DDH and V DD .
Table 5. DC Electrical Characteristics
Input high voltage , all inputs except CLKIN
1
Characteristic
Symbol
V IH
Min
2.0
Typical
Max
3.465
Unit
V
Input low voltage
1
V IL
GND
0
0.8
V
CLKIN input high voltage
CLKIN input low voltage
Input leakage current, V IN = V DDH
Tri-state (high impedance off state) leakage current, V IN = V DDH
Signal low input current, V IL = 0.8 V 2
V IHC
V ILC
I IN
I OZ
I L
2.4
GND
–1.0
–1.0
–1.0
3.0
0
0.09
0.09
0.09
3.465
0.8
1
1
1
V
V
μA
μA
μA
Signal high input current, V IH = 2.0 V
Output high voltage, I OH = –2 mA,
2
I H
V OH
–1.0
2.0
0.09
3.0
1
μA
V
except open drain pins
Output low voltage, I OL = 3.2 mA
V CCSYN PLL supply current
V OL
I VCCSYN
0
2
0.4
4
V
mA
Internal supply current:
? Wait mode
? Stop mode
Typical power 400 MHz at 1.2 V 4
I DDW
I DDS
P
375 3
290 3
1.15
mA
mA
W
Notes:
1.
2.
3.
4.
See Figure 5 for undershoot and overshoot voltages.
Not tested. Guaranteed by design.
Measured for 1.2 V core at 25°C junction temperature.
The typical power values were measured using an EFR code with the device running at a junction temperature of 25°C. No
peripherals were enabled and the ICache was not enabled. The source code was optimized to use all the ALUs and AGUs and
all four cores. It was created using CodeWarrior ? 2.5. These values are provided as examples only. Power consumption is
application dependent and varies widely. To assure proper board design with regard to thermal dissipation and maintaining
proper operating temperatures, evaluate power consumption for your application and use the design guidelines in Chapter 4 of
this document and in MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601).
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
Freescale Semiconductor
15
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