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参数资料
| 型号： | MSC8126TVT6400 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 44/48页 |
| 文件大小： | 0K |
| 描述： | IC DSP QUAD 16B 400MHZ 431FCPBGA |
| 标准包装： | 60 |
| 系列： | StarCore |
| 类型： | SC140 内核 |
| 接口： | DSI，以太网，RS-232 |
| 时钟速率： | 400MHz |
| 非易失内存： | 外部 |
| 芯片上RAM： | 1.436MB |
| 电压 - 输入/输出： | 3.30V |
| 电压 - 核心： | 1.20V |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 431-BFBGA，FCBGA |
| 供应商设备封装： | 431-FCPBGA（20x20） |
| 包装： | 托盘 |
| 配用： | MSC8126ADSE-ND - KIT ADVANCED DEV SYSTEM 8126 |
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Ordering Information
3.5
Thermal Considerations
An estimation of the chip-junction temperature , T J , in ° C can be obtained from the following:
T J = T A + (R θ JA × P D )
Eqn. 1
where
T A = ambient temperature near the package ( ° C)
R θ JA = junction-to-ambient thermal resistance ( ° C/W)
P D = P INT + P I/O = power dissipation in the package (W)
P INT = I DD × V DD = internal power dissipation (W)
P I/O = power dissipated from device on output pins (W)
The power dissipation values for the MSC8126 are listed in Table 2-3 . The ambient temperature for the device is the air
temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances are JEDEC
standard values that provide a quick and easy estimation of thermal performance. There are two values in common usage: the
value determined on a single layer board and the value obtained on a board with two planes. The value that more closely
approximates a specific application depends on the power dissipated by other components on the printed circuit board (PCB).
The value obtained using a single layer board is appropriate for tightly packed PCB configurations. The value obtained using a
board with internal planes is more appropriate for boards with low power dissipation (less than 0.02 W/cm 2 with natural
convection) and well separated components. Based on an estimation of junction temperature using this technique, determine
whether a more detailed thermal analysis is required. Standard thermal management techniques can be used to maintain the
device thermal junction temperature below its maximum. If T J appears to be too high, either lower the ambient temperature or
the power dissipation of the chip. You can verify the junction temperature by measuring the case temperature using a small
diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case that is painted
black. The MSC8126 device case surface is too shiny (low emissivity) to yield an accurate infrared temperature measurement.
Use the following equation to determine T J :
where
T J = T T + ( θ JA × P D )
T T = thermocouple (or infrared) temperature on top of the package ( ° C)
θ JA = thermal characterization parameter ( ° C/W)
P D = power dissipation in the package (W)
Eqn. 2
Note:
4
See MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601/D).
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
MSC8126
Package Type
Flip Chip Plastic Ball Grid Array (FC-PBGA)
Spheres
Lead-free
Core
Voltage
1.2 V
Operating
Temperature
–40° to 105°C
Core
Frequency
(MHz)
400
Order Number
MSC8126TVT6400
Lead-bearing
MSC8126TMP6400
Lead-free
Lead-bearing
0° to 90°C
500
MSC8126VT8000
MSC8126MP8000
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
44
Freescale Semiconductor
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