参数资料
型号: MT48LC8M16LFF4-10IT:G
元件分类: DRAM
英文描述: 8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54
封装: 8 X 8 MM, VFBGA-54
文件页数: 76/80页
文件大小: 2775K
PDF: 09005aef807f4885/Source: 09005aef8071a76b
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
78
2001 Micron Technology, Inc. All rights reserved.
128Mb: x16, x32 Mobile SDRAM
Package Dimensions
Figure 57:
54-Ball FBGA, “F4/B4” Package (x16 Device), 8mm x 8mm
Notes:
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.40mm.
3. Topside part marking decoder can be found at www.micron.com/decoder.
BALL A1 ID
0.65 ±0.05
SEATING PLANE
0.10 C
C
1.00 MAX
BALL A9
0.80
TYP
0.80 TYP
3.20
6.40
8.00 ±0.10
4.00 ±0.05
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
54X 0.45 ±0.05
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS:
0.40
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
6.40
3.20
4.00 ±0.05
8.00 ±0.10
CL
BALL A1 ID
BALL A1
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相关代理商/技术参数
参数描述
MT48LC8M16LFF4-75M IT 制造商:Micron Technology Inc 功能描述:DRAM CHIP MOBILE SDRAM 128MBIT 3.3V 54FBGA - Trays