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参数资料
| 型号： | NAND02GR4B2BZB1 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 128M X 16 FLASH 1.8V PROM, 35 ns, PBGA63 |
| 封装： | 9.50 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63 |
| 文件页数： | 32/57页 |
| 文件大小： | 887K |
| 代理商： | NAND02GR4B2BZB1 |
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NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
38/57
PROGRAM AND ERASE TIMES AND ENDURANCE CYCLES
The Program and Erase times and the number of
Program/ Erase cycles per block are shown in Ta-
Table 18. Program, Erase Times and Program Erase Endurance Cycles
MAXIMUM RATING
Stressing the device above the ratings listed in Ta-
ble 19., Absolute Maximum Ratings, may cause
permanent damage to the device. These are
stress ratings only and operation of the device at
these or any other conditions above those indicat-
ed in the Operating sections of this specification is
not implied. Exposure to Absolute Maximum Rat-
ing conditions for extended periods may affect de-
vice
reliability.
Refer
also
to
the
STMicroelectronics SURE Program and other rel-
evant quality documents.
Table 19. Absolute Maximum Ratings
Note: 1. Minimum Voltage may undershoot to –2V for less than 20ns during transitions on input and I/O pins. Maximum voltage may over-
shoot to VDD + 2V for less than 20ns during transitions on I/O pins.
2. Compatibility with Lead-free soldering processes in accordance with ECOPACK 7191395 specifications. Not exceeding 250°C for
more than 10s, and peaking at 260°C.
Parameters
NAND Flash
Unit
Min
Typ
Max
Page Program Time
300
700
s
Block Erase Time
2
3ms
Program/Erase Cycles (per block)
100,000
cycles
Data Retention
10
years
Symbol
Parameter
Value
Unit
Min
Max
TBIAS
Temperature Under Bias
– 50
125
°C
TSTG
Storage Temperature
– 65
150
°C
TLEAD
Lead temperature during soldering (2)
260
°C
VIO
(1)
Input or Output Voltage
1.8V devices
– 0.6
2.7
V
3 V devices
– 0.6
4.6
V
VDD
Supply Voltage
1.8V devices
– 0.6
2.7
V
3 V devices
– 0.6
4.6
V
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相关代理商/技术参数 |
参数描述 |
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| NAND02GR4B2DE06 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND02GR4B2DWFD | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
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