参数资料
型号: ORT82G51BM680-DB
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: FPGA
英文描述: FPGA, 1296 CLBS, 380000 GATES, PBGA680
封装: PLASTIC, FBGA-680
文件页数: 2/109页
文件大小: 1379K
代理商: ORT82G51BM680-DB
10
Lattice Semiconductor
Data Sheet
April, 2002
8b/10b SERDES Backplane Interface FPSC
ORCA ORT82G5 1.0-1.25/2.0-2.5/3.125-3.5 Gbits/s
System-Level Features (continued)
Conguration
The FPGAs functionality is determined by internal con-
guration RAM. The FPGAs internal initialization/con-
guration circuitry loads the conguration data at
powerup or under system control. The conguration
data can reside externally in an EEPROM or any other
storage media. Serial EEPROMs provide a simple, low
pin-count method for conguring FPGAs.
The RAM is loaded by using one of several congura-
tion modes. Supporting the traditional master/slave
serial, master/slave parallel, and asynchronous periph-
eral modes, the Series 4 also utilizes its microproces-
sor interface and embedded system bus to perform
both programming and readback. Daisy chaining of
multiple devices and partial reconguration are also
permitted.
Other conguration options include the initialization of
the embedded-block RAM memories and FPSC mem-
ory as well as system bus options and bit stream error
checking. Programming and readback through the
JTAG (IEEE 1149.2) port is also available meeting in-
system programming (ISP) standards (IEEE 1532
Draft).
Additional Information
Contact your local Lattice representative for additional
information regarding the ORCA Series 4 FPGA
devices, or visit our website at:
http://www.latticesemi.com/
相关PDF资料
PDF描述
OSC-1B1FREQ TCVCXO, CLIPPED SINE OUTPUT, 10 MHz - 50 MHz
OSC-3A110MHZ TCVCXO, CLIPPED SINE OUTPUT, 10 MHz
OSC-3B219.68MHZ TCVCXO, CLIPPED SINE OUTPUT, 19.68 MHz
OSC1213A TCVCXO, SINE OUTPUT, 13 MHz
OSC1218D TCVCXO, SINE OUTPUT, 12.8 MHz
相关代理商/技术参数
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ORT82G5-1F680I 功能描述:FPGA - 现场可编程门阵列 ORCA FPSC 2.7Gbits/s BP XCVR 643K RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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