参数资料
| 型号： | PCF8562TT/S400/2,1 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 36/43页 |
| 文件大小： | 0K |
| 描述： | IC LCD DRIVER 48-TSSOP |
| 标准包装： | 2,000 |
| 显示器类型： | LCD |
| 配置： | 7段 + DP，14段 + DP + AP，点阵 |
| 接口： | I²C，2 线串口 |
| 数字或字符： | 8 个字符，16 个字符 |
| 电流 - 电源： | 8µA |
| 电源电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-TFSOP（0.240"，6.10mm 宽） |
| 供应商设备封装： | 48-TSSOP |
| 包装： | 带卷 (TR) |
| 其它名称： | PCF8562TTS40021 |
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NXP Semiconductors
PCF8562
Universal LCD driver for low multiplex rates
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A , IEC 61340-5 or equivalent
standards.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
? Through-hole components
? Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
?
?
?
?
?
?
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
PCF8562
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 June 2011
? NXP B.V. 2011. All rights reserved.
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| PCF8563 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Real-time clock/calendar |
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