参数资料
| 型号： | PCX7447AVGH1000NB |
| 厂商： | Atmel |
| 文件页数： | 3/52页 |
| 文件大小： | 0K |
| 描述： | IC MPU 32BIT 1000MHZ 360CBGA |
| 标准包装： | 44 |
| 处理器类型： | PowerPC 32-位 RISC |
| 速度： | 1.0GHz |
| 电压： | 1.1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 360-CBBGA 裸露焊盘 |
| 供应商设备封装： | 360-CBGA（25x25） |
| 包装： | 托盘 |
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11
0833E–HIREL–01/07
e2v semiconductors SAS 2007
PC7447A
Notes:
1. Caution: The input threshold selection must agree with the OVDD voltages supplied. See notes in Table 6-1 on page 9.
2. If used, pull-down resistors should be less than 250
.
6.4
Thermal Characteristics
6.4.1
Package Characteristics
Notes:
1. See “Thermal Management Information” on page 12 for details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
ture, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. This is the thermal resistance between the die and the case top surface as measured with the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
6.4.2
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 6-4 on page 11, the intrinsic conduction
thermal resistance paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-ball thermal resistance
Figure 9-2 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Table 6-3.
Input Threshold Voltage Setting(1)
BVSEL Signal
Processor Bus Input Threshold is Relative to:
Notes
01.8V
HRESET
Not available
HRESET
2.5V
12.5V
Table 6-4.
Package Thermal Characteristics
Symbol
Characteristic
Value
Unit
RθJA
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
26
°C/W
RθJMA
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
19
°C/W
RθJMA
Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer (1s) board
20
°C/W
RθJMA
Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer (2s2p) board
16
°C/W
RθJB
Junction-to-board thermal resistance
10
°C/W
RθJC
Junction-to-case thermal resistance
< 0.1
°C/W
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| PCX7447AVGH1167NB | 功能描述:IC MPU 32BIT 1167MHZ 360CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:60 系列:SCC 处理器类型:Z380 特点:全静电 Z380 CPU 速度:20MHz 电压:5V 安装类型:表面贴装 封装/外壳:144-LQFP 供应商设备封装:144-LQFP 包装:托盘 |
| PCX7448MGH1000NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
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